The Role of Arlon 35N in High Performance PCBs

A PCB material comprises a sheet of prepreg that is suitable for PCB fabrication. This material plays a critical role for durability and performance of a circuit board. Also, there are a wide variety of PCB laminates in the industry. However, polyimide and FR4 are some of the most popular materials. Material selection determines the efficiency of PCBs.

Not all PCB materials function well in high performance applications. Therefore, some materials are specially designed for such applications. In this article, we will be discussing Arlon 35N PCB material.

What is Arlon 35N PCB Material?

Arlon 35N PCB Material is a polyimide resin and prepreg designed for high temperature performance applications. Also, Arlon 35N is a thermally reliable PCB material with great properties. This high glass transition temperature material resists PTH failures when functioning in harsh conditions. Also, it has reduced cure times. Therefore, this provides enhanced throughput during processing.

Arlon 35N PCB material is a great alternative to other polyimide materials. This PCB base material has been reinforced with polyimide that is totally cured. The low Z-axis expansion of this material makes it resist PTH failure during processing. Also, this feature reduces latent PTH defects risks in-service. This Arlon PCB material is specially designed with quality and high performance in mind.

This PCB laminate is widely used in applications exposed to high temperatures. Also, its properties contribute to its performance and functionality. In addition, this PCB material comprises no carcinogenic components.

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Properties of Arlon 35N PCB Material

This PCB material features excellent thermal, mechanical, and electrical properties. These properties play a crucial role in the functionality of this laminate.

Low Z-axis CTE

The Coefficient of thermal expansion on Z-axis before Tg is 51 ppmo/C. After Tg, the Z-axis CTE is 158 ppmo/C. Therefore, this reduces the risk of PTH errors caused during the attachment of device and solder reflow.

High glass transition temperature

The Tg value of Arlon 35N PCB material is greater than 250 degrees Celsius. Therefore, this material softens and becomes hard when exposed to a temperature above 250oC.

High thermal conductivity

This material features a thermal conductivity of 0.2 W/m/K. Thermal conductivity is very important for sufficient heat distribution.

High decomposition temperature

The decomposition temperature of Arlon 35N is above 407 degrees Celsius at 5% weight loss. Therefore, Arlon 35N PCB material is prone to decomposition when exposed to a temperature above 407oC.

Low dissipation factor

The dissipation factor of Arlon 35N is 0.01 at 1MHz. Therefore, this material doesn’t dissipate or absorb heat at a faster rate. It is an efficient insulator. Also, it can function well in high temperature applications.

High Peel strength

The peel strength of this material is 6.3 (1.1) Ib/In (N/mm). This value indicates a high peel strength. Therefore, the bonding force between the laminate and the copper is very high.

Low moisture absorption

The water absorption rate of this material is 0.26%. Therefore, Arlon 35N is highly resistant to water. Also, due to this property, this material is resistant to delamination.

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Processing Guidelines for Arlon 35N PCB Material

These processing guidelines consist of the lamination and drilling process of Arlon 35N PCB material:

  • When processing the inner layers of this material, use industry practices. These practices will help to etch and strip inner layers.
  • Also, utilize brown oxide on internal layers.
  • Make sure you adjust dwell time to guarantee uniform coating.
  • Bake the internal layers in a rack for 1 hour at about 250oF before lay-up.
  • Store the prepreg at a temperaturewithin 60-700
  • Regulate the heat rise to 4.5 – 6.5 degrees Celsius per minute between 100 and 150 degrees Celsius.
  • Vacuum lamination is very advisable.
  • Ensure you set cure temperature at 415o Also, start the cure time when prepreg temperature exceeds 210 degrees Celsius.
  • It is important to note that cure time at temperature is 90 minutes. However, use 60 minutes for the first lamination in the sequential lamination. Then, use 90 minutes for the final lamination.
  • Use alkaline permanganate to desmear. However, plasma is highly recommended for positive etchback.
  • Arlon 35N is very compatible with conventional plating processes.
  • You can make use of standard profiling parameters. However, a chipbreaker style router is not advisable.

Factors to Consider when Choosing Arlon 35N PCB Material

There are factors that determine the type of Arlon PCB materials to choose. Arlon materials are designed to meet different specific needs. Therefore, it is important to choose a material that meets your requirements. When choosing Arlon 35N PCB material, it is important to consider:

Thermal performance

The thermal properties of this material contribute to its thermal performance. When choosing Arlon 35N, ensure its thermal properties meet the requirements of your PCB project. For example, consider the thermal environment of the intended application.

Environmental friendliness

This is a great factor you need to put into consideration when choosing Arlon 35N. You want a material that is environmentally safe. Arlon 35N suits this purpose. Also, this material features no halogen or lead components.

Cost

Arlon 35N is a cost-effective polyimide material. This PCB material is a better alternative to other polyimide laminates. This is because it strikes a balance between performance and cost.

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Advantages of Arlon 35N PCB Material

Industry recognition

Arlon PCB material meets most PCB industry standards. Also, this material meets the requirements and specifications of IPC4101/40 and /41. Furthermore, it meets the flammability requirements of UL-94 V-1.

Lead-free processing compatibility

This material is free of lead. Therefore, it is compatible with lead free processing. This makes the material an industry standard for PCB fabrication.

Best thermal properties

This material features best-in-class thermal characteristics. For example, it features a high Td and Tg value. Also, the Z-axis CTE is very low. Therefore, this helps to reduce risk of PTH defects that result from solder reflow.

Wide range of applications

This material is ideal for use in a wide range of applications. Also, it is ideal for PCBs exposed to high temperatures during processing. Arlon 35N plays a crucial role in applications frequently subjected to high temperatures. Therefore, you will find them in aircraft engine instrumentation and industrial sensors.

Conclusion

The information in this article helps you to know more about Arlon 35N PCB material.