LTM8033IY#PBF is an EMC-Compatible µModule Buck Converter: Here’s How It Works

DC/DC converters are generally used to convert power supply from one source to that of a corresponding source. For example, a DC-DC converter allows for the conversion of a direct current voltage input level to a direct current voltage output level.

However, when we dig deeper, we would see that there are some variants of a DC-DC converter that don’t tow the same line. LTM8033IY#PBF is an example of such. Rather than converting the direct current voltage input level to a voltage output variant, it follows a different path. That path is called the µModule Buck Converter.

What Does a µModule Buck Converter Do?

According to All About Circuits, the function of a µModule Buck Converter is to “efficiently convert a high-voltage to a low-voltage.”

Now, most of the power-sensitive applications use an µModule Buck Converter because of the flexible power conversion method that keeps these applications “cool.”

EMC-Compatibility

LTM8033IY#PBF is an Electromagnetic Compatible (EMC) µModule Buck Converter. The compatibility is to the effect for the device to comply with the EN55022 radiation emission requirements.

In addition to the compliance with the EN55022 Class B requirements, LTM8033IY#PBF also ensures that the components for the compliance are in place. For example, it allows the integration or addition of standard filter components to meet the conducted emission requirements.

The Non-Isolated Power Conversion Process

LTM8033IY#PBF supports a non-isolated DC-TO power conversion process. The process paves the way for the device to potentially prevent an isolation during the power conversion phase.

Although the non-isolated Point-of-Load (PoL) module has been criticized because of the removal of thermal conducting processes; it still has some unique features.

With the PoL module, it is possible to facilitate the power conversion as there are no transformers or other “obstructive components” that could take a lot of time before the power conversion takes place.

Automated Assembly

As much as you are looking to use an µModule Buck Converter to simplify the power conversion methods, it is also imperative to take note of the circuit assembly process.

LTM8033IY#PBF’s circuit assembly process is automated, thanks to the small form-factor size and the mounting style. The package uses a 11.25mm by 15mm by 4.32mm overmolded Land Grid Array (LGA) and a Ball Grid Array (BGA).

These two make it possible to automatically mount the components using the Surface Mount Technology (SMT).

Component Availability

Most of the components needed for power or current transmission are readily available. For instance, LTM8033IY#PBF includes filters, switching controller, inductor and power switches in the package.

Therefore, the primary provisions to make are the duo of the bulk input and output filter to finish the design.

What You Need to Know About the µModule Regulator Technology

The µModule Regulator Technology is a laser-focused technology designed to facilitate the regulation of the digital power system, in terms of management.

To that end, Analog Devices Incorporated, LTM8033IY#PBF’s manufacturer released the technology to serve the following purposes:

1. Complete SiP Solution

The µModule Regulator Technology houses most of the components and configuration-centric peripherals. Examples of these are:

  • Inductors
  • Integrated DC-to-DC controllers
  • Compensation components
  • Input and output capacitors
  • Power transistors

The idea is to offer a complete System-in-Package (SiP) power management solution that makes reliable power management solutions handy.

The Silent Switcher Technology

The Silent Switcher Technology, as the name implies, allows for the silent or no-noise switching of the frequencies.

Typically, the power devices will operate at higher frequencies, without necessarily making more noises or comprising the high-efficiency design of the power devices. Besides, the technology also supports the drastic reduction of the EMI emissions, especially with the compliance with the EN55022 radiation emission requirements.

2. Support for Several Noise Standards

The Silent Switcher Technology also withstands higher noise dissipation from the power devices because it complies with multiple noise standards. For example, it supports the following noise-immunity standards:

  • CISPR 25 Class 5 for the “automotive devices.”
  • CISPR 22 Class B for both the communications and industrial devices/applications.

3. Current Sharing

The µModule Regulator Technology also introduced a concept called “Current Sharing.” Wondering what it is? Current Sharing is an innovative power transmission model that allows for the combination or usage of several devices with one goal – to deliver the highest output levels possible.

In addition to enabling load sharing across all the devices, the Current Sharing also allows the power devices to effectively dissipate heat. For example, this time, not only one device would be dissipating heat. Rather, all of the connected power devices would now be sharing heat evenly.

4. Monitoring and Controlling Functions

LTM8033IY#PBF’s µModule Regulator Technology also aids the controlling and monitoring of the power devices. The goal here is to ensure that the operating parameters are functioning as they ought to.

To function effectively, the control and monitor functions work with several peripherals, including the PMBus/SMBus/I2C digital interface for the control, telemetry and monitoring of the power devices’ operating parameters.

The Function of the CoP Technology

Analog Devices Incorporated also created a distinct technology called the Component-on-Package (CoP). At the core of this technology’s performance is the thermal management improvement, through the removal or dissipation of heat through the sides/corners and the top-most parts of the power devices.

The CoP technology also offers higher power, a balanced thermal management, faster cooling for the Micromodule (µModule) regulators – and helps in cutting down on the Printed Circuit Board (PCB)’s footprint.

LTM8033IY#PBF Product Attributes

Below is a tabular representation of LTM8033IY#PBF’s properties:

AttributesValues
TypeNon-Isolated PoL Module
Maximum Current Output3A
Voltage – Output 1Between 0.8 volts and 24 volts
Minimum Voltage – Input3.6 volts
Number of Outputs1
Operating TemperatureBetween 40˚C and 125˚C
Base Product NumberLTM8033
Mounting TypeSurface Mount

Final Thoughts on LTM8033IY#PBF

LTM8033IY#PBF’s µModule Buck Converter is an excellent technological process of transmitting or moving converted high-voltage power to the low-voltage variant. Besides automating the process, the converter also helps in reducing (excessive) heat dissipation – in conjunction with the Component-on-Package (CoP) technology.

You can also count on the µModule Buck Converter to make the power devices compatible with the smaller consumer electronics, as well as extending the devices’ battery lives.

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