A2F500M3G-1FGG256M ApplicationField
-Wireless Technology
-Industrial Control
-Artificial Intelligence
-5G Technology
-Cloud Computing
-Internet of Things
-Medical Equipment
-Consumer Electronics
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A2F500M3G-1FGG256M FAQ Chips
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Q: Where can I purchase Microsemi A2F500 Development Boards, Evaluation Boards, or SmartFusion Customizable System-on-Chip Starter Kit? also provide technical information?
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A: Enter the “A2F500M3G-1FGG256M” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
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ICs A2F500M3G-1FGG256M Features
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Xilinx A2F500M3G-1FGG256M Overview
The SmartFusion family of cSoCs builds on the technology first introduced with the Fusion mixed signal
FPGAs. SmartFusion cSoCs are made possible by integrating FPGA technology with programmable
high-performance analog and hardened ARM Cortex-M3 microcontroller blocks on a flash semiconductor
process. The SmartFusion cSoC takes its name from the fact that these three discrete technologies are
integrated on a single chip, enabling the lowest cost of ownership and smallest footprint solution to you.
The Microsemi Embedded – System On Chip (SoC) series A2F500M3G-1FGG256M is IC SOC CORTEX-M3 100MHZ 256FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
A2F500M3G-1FGG256M Tags integrated circuit
1. A2F500 evaluation board
2. A2F500 development board
3. SmartFusion Customizable System-on-Chip starter kit
4. SmartFusion Customizable System-on-Chip A2F500
5. SmartFusion Customizable System-on-Chip evaluation kit
6. A2F500 reference design
7. A2F500M3G-1FGG256M Datasheet PDF
8. Microsemi SmartFusion Customizable System-on-Chip development board
9. SmartFusion Customizable System-on-Chip A2F500
Xilinx A2F500M3G-1FGG256M TechnicalAttributes
-Package / Case 256-LBGA
-Core Processor ARM? Cortex?-M3
-Architecture MCU, FPGA
-Primary Attributes ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
-Flash Size 512KB
-Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
-RAM Size 64KB
-Operating Temperature -55℃ ~ 125℃ (TJ)
-Speed 100MHz
-Peripherals DMA, POR, WDT
-Supplier Device Package 256-FPBGA (17×17)
