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A3P1000-FG256M FAQ Chips
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ICs A3P1000-FG256M Features
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Xilinx A3P1000-FG256M Overview
ProASIC3, the third-generation family of Microsemi flash FPGAs, offers performance, density, and
features beyond those of the ProASICPLUS family. Nonvolatile flash technology gives ProASIC3 devices
the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3 is
reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable
designers to create high-density systems using existing ASIC or FPGA design flows and tools.
ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as
clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and A3P030
devices have no PLL or RAM support.
ProASIC3 devices have up to 1 million system gates, supported
with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os.
ProASIC3 devices support the ARM Cortex-M1 processor. The ARM-enabled devices have Microsemi
ordering numbers that begin with M1A3P (Cortex-M1) and do not support AES decryption.
A3P1000-FG256M Tags integrated circuit
1. A3P1000 reference design
2. FPGA ProASIC3 evaluation kit
3. Microsemi A3P1000
4. A3P1000 development board
5. A3P1000 evaluation board
6. FPGA ProASIC3 starter kit
7. Microsemi FPGA ProASIC3 development board
8. A3P1000-FG256M Datasheet PDF
9. A3P1000 development board
Xilinx A3P1000-FG256M TechnicalAttributes
-Voltage – Supply 1.14V ~ 1.575V
-Mounting Type Surface Mount
-Supplier Device Package 256-FPBGA (17×17)
-Total RAM Bits 147456
-Number of I/O 177
-Number of Gates 1000000
-Package / Case 256-LBGA
-Operating Temperature -55℃ ~ 125℃ (TJ)