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AC22iHD1000-F45C3ES FAQ Chips
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ICs AC22iHD1000-F45C3ES Features
PCI Express Gen 1/2/3, ×1, ×4, ×8 with DMAengine
640 bit logic RAM (LRAM) running at 750 MHz
• Advanced highest‐density and highest‐bandwidth FPGA
• Large capacity
Up to 82 Mb of block RAM
Fully re‐programmable, SRAM based
10/40/100 Gigabit Ethernet MAC
Synchronous core and I/O
• Up to 64 channels of embedded 10.3125 Gbps Ser‐Des:
80 Kb block RAMs running at 750 MHz
DDR 2/3 72 bits wide
• Industry‐standard register transfer level (RTL) syn‐ thesis support using Synplify‐Pro from Synopsys
Built on Intel’s advanced 22‐nm 3‐D Tri‐Gate process technology
Abundant embedded hard IP for communications applications
PCI Express Gen 1/2/3
10/40/100 Gigabit Ethernet (XFI, XAUI, XLAUI,CAUI)
Rapid timing closure yielding significant time‐to‐market advantages Embedded (hard IP)
Up to 1 million effective look‐up‐tables
CEI‐6 SR/LR, CEI‐11 SR
Request AC22iHD1000-F45C3ES FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx AC22iHD1000-F45C3ES Overview
AC22iHD1000-F45C3ES device run at a maximum rate of 750 MHz and have effective densities of up to one million LUTs. Based on the Intel 22nm process, AC22iHD1000-F45C3ES device is SRAM based and fully reconfigurable. Logic resources are provided using standard, synchronous, 4‐input LUTs. A reconfigurable logic block (RLB) contains ten LUTs, and has ten registers. AC22iHD1000-F45C3ES device also contain block RAMs. Each block RAM is 80 kb in size and allows true dual port access.The I/O frame contains embedded controller IP, configurable I/O, SerDes, clock generator blocks with phase lock loops (PLLs), and the device configuration logic. AC22iHD1000-F45C3ES contain up to sixty‐four lanes of 10.3125 Gbps SerDes and up to an additional 960 high‐speed reconfigurable I/O. Additional dedicated hard IP includes up to six DDR2/3 PHY and controllers, up to forty eight 10 Gb Ethernet controllers, up to twelve 40G Ethernet controllers and up to four 100G Ethernet controllers. There are also are up to four Interlaken controllers and two PCI Express controllers, all available as embedded hard IP and therefore use none of the reconfigurable logic fabric and achieve maximum performance without the need for timing closure/optimization.There are also dedicated I/O for the embedded programming and configuration logic (CFG) designed to support a variety of programming options. Dedicated clock I/O pins are located near the corners of each Speedster device.FPGA Core The core of an Achronix AC22iHD1000-F45C3ES contain columns of logic, memory and multiplier/accumulators (BMACs) connected with a global interconnect as shown in figure 2 below. Columns of reconfigurable logic blocks (RLBs) are interspersed with columns of block RAMs (BRAMs) and local RAMs (LRAMs) and BMACs. The core also includes global and local clock networks as well as reset networks.
AC22iHD1000-F45C3ES Tags integrated circuit
1. Speedster22i HD starter kit
2. AC22iHD1000 development board
3. Speedster22i HD evaluation kit
4. Achronix Speedster22i HD development board
5. Achronix AC22iHD1000
6. AC22iHD1000-F45C3ES Datasheet PDF
7. Speedster22i HD AC22iHD1000
8. AC22iHD1000 evaluation board
9. Achronix Speedster22i HD development board
Xilinx AC22iHD1000-F45C3ES TechnicalAttributes
-Interlaken LLC 2
-User (programmable) I/O 960
-Logic capacity with embedded IP (effective LUTs) 1,045,000
-80 Kb BRAM (total Kb) 82,080
-Number of BRAM Instances 1,026
-Number of LRAM Instances 6,156
-Programmable LUTs 700,000
-PCI Express LLC 2
-40G Ethernet MAC 6
-Multiplier/accumulators (BMACs) 756
-SerDes Lanes 10.3125 Gbps 64
-Number of PLLs 16
-640-bit LRAM (total Kb) 3,940
-100G Ethernet MAC 2
-DDR3/DDR2 controller 6
-10G Ethernet MAC 24