EP2C8Q208I8N ApplicationField
-Consumer Electronics
-Medical Equipment
-Internet of Things
-Artificial Intelligence
-5G Technology
-Cloud Computing
-Wireless Technology
-Industrial Control
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ICs EP2C8Q208I8N Features
The Cyclone II device family offers the following features:
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Xilinx EP2C8Q208I8N Overview
Functional
Description
Cyclone® II devices contain a two-dimensional row- and column-based
architecture to implement custom logic. Column and row interconnects
of varying speeds provide signal interconnects between logic array
blocks (LABs), embedded memory blocks, and embedded multipliers.
The logic array consists of LABs, with 16 logic elements (LEs) in each
LAB. An LE is a small unit of logic providing efficient implementation of
user logic functions. LABs are grouped into rows and columns across the
device. Cyclone II devices range in density from 4,608 to 68,416 LEs.
Cyclone II devices provide a global clock network and up to four
phase-locked loops (PLLs). The global clock network consists of up to 16
global clock lines that drive throughout the entire device. The global clock
network can provide clocks for all resources within the device, such as
input/output elements (IOEs), LEs, embedded multipliers, and
embedded memory blocks. The global clock lines can also be used for
other high fan-out signals. Cyclone II PLLs provide general-purpose
clocking with clock synthesis and phase shifting as well as external
outputs for high-speed differential I/O support.
M4K memory blocks are true dual-port memory blocks with 4K bits of
memory plus parity (4,608 bits). These blocks provide dedicated true
dual-port, simple dual-port, or single-port memory up to 36-bits wide at
up to 260 MHz. These blocks are arranged in columns across the device
in between certain LABs. Cyclone II devices offer between 119 to
1,152 Kbits of embedded memory.
Each embedded multiplier block can implement up to either two 9 × 9-bit
multipliers, or one 18 × 18-bit multiplier with up to 250-MHz
performance. Embedded multipliers are arranged in columns across the
device.
Each Cyclone II device I/O pin is fed by an IOE located at the ends of LAB
rows and columns around the periphery of the device. I/O pins support
various single-ended and differential I/O standards, such as the 66- and
33-MHz, 64- and 32-bit PCI standard, PCI-X, and the LVDS I/O standard
at a maximum data rate of 805 megabits per second (Mbps) for inputs and
640 Mbps for outputs. Each IOE contains a bidirectional I/O buffer and
three registers for registering input, output, and output-enable signals.
Dual-purpose DQS, DQ, and DM pins along with delay chains (used to phase-align double data rate (DDR) signals) provide interface support for
external memory devices such as DDR, DDR2, and single data rate (SDR)
SDRAM, and QDRII SRAM devices at up to 167 MHz.
Features
■ High-density architecture with 4,608 to 68,416 LEs
● M4K embedded memory blocks
● Up to 1.1 Mbits of RAM available without reducing available logic
● 4,096 memory bits per block (4,608 bits per block including 512 parity bits)
● Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32,and ×36
● True dual-port (one read and one write, two reads, or two writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes
● Byte enables for data input masking during writes
● Up to 260-MHz operation
■ Embedded multipliers
● Up to 150 18- × 18-bit multipliers are each configurable as two independent 9- × 9-bit multipliers with up to 250-MHz performance
● Optional input and output registers
■ Advanced I/O support
● High-speed differential I/O standard support, including LVDS,RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL
● Single-ended I/O standard support, including 2.5-V and 1.8-V,SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCIand PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-,and 1.8-V LVTTL
● Peripheral Component Interconnect Special Interest Group (PCISIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V operation at 33 or 66 MHz for 32- or 64-bit interfaces
● PCI Express with an external TI PHY and an Altera PCI Express ×1 Megacore® function
● 133-MHz PCI-X 1.0 specification compatibility
● High-speed external memory support, including DDR, DDR2,and SDR SDRAM, and QDRII SRAM supported by drop in Altera IP MegaCore functions for ease of use
● Three dedicated registers per I/O element (IOE): one input register, one output register, and one output-enable register
● Programmable bus-hold feature
● Programmable output drive strength feature
● Programmable delays from the pin to the IOE or logic array
● I/O bank grouping for unique VCCIO and/or VREF bank settings
● MultiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces
● Hot-socketing operation support
● Tri-state with weak pull-up on I/O pins before and during configuration
● Programmable open-drain outputs
● Series on-chip termination support
■ Flexible clock management circuitry
● Hierarchical clock network for up to 402.5-MHz performance
● Up to four PLLs per device provide clock multiplication and division, phase shifting, programmable duty cycle, and external clock outputs, allowing system-level clock management and skew control
● Up to 16 global clock lines in the global clock network that drive throughout the entire device
■ Device configuration
● Fast serial configuration allows configuration times less than 100 ms
● Decompression feature allows for smaller programming file storage and faster configuration times
● Supports multiple configuration modes: active serial, passive serial, and JTAG-based configuration
● Supports configuration through low-cost serial configuration devices
● Device configuration supports multiple voltages (either 3.3, 2.5,or 1.8 V)
■ Intellectual property
● Altera megafunction and Altera MegaCore function support,and Altera Megafunctions Partners Program (AMPPSM) megafunction support, for a wide range of embedded processors, on-chip and off-chip interfaces, peripheral functions, DSP functions, and communications functions and protocols. Visit the Altera IPMegaStore at www.altera.com to
download IP MegaCore functions.
● Nios II Embedded Processor support
The INTEL Embedded – FPGAs (Field Programmable Gate Array) series EP2C8Q208I8N is Conn Solar Cable Assembly 12AWG, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
EP2C8Q208I8N Tags integrated circuit
1. Cyclone II FPGA starter kit
2. INTEL EP2C8
3. EP2C8 evaluation board
4. EP2C8Q208I8N Datasheet PDF
5. EP2C8 reference design
6. Cyclone II FPGA evaluation kit
7. EP2C8 development board
8. INTEL Cyclone II FPGA development board
9. EP2C8Q208I8N Datasheet PDF
Xilinx EP2C8Q208I8N TechnicalAttributes
-Distributed RAM 166 kbit
-Operating Supply Voltage 1.15 V to 1.25 V
-Package / Case QFP-208
-Number of I/Os 138
-Packaging Tray
-Embedded Block RAM – EBR 166 kbit
-Minimum Operating Temperature – 40℃
-Series Cyclone II
-Maximum Operating Temperature + 85℃
-Mounting Style SMD/SMT
-Number of Logic Blocks 516
