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LCMXO3D-9400ZC-3BG400I FAQ Chips
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Q: Where can I purchase Lattice LCMXO3D-9400 Development Boards, Evaluation Boards, or MachXO3D Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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ICs LCMXO3D-9400ZC-3BG400I Features
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Xilinx LCMXO3D-9400ZC-3BG400I Overview
The LCMXO3D-9400 is the next generation of Lattice Semiconductor Low Density PLDs including enhanced security features and on-chip dual boot flash. The enhanced security features include Advanced Encryption Standard (AES) AES-128/256, Secure Hash Algorithm (SHA) SHA-256, Elliptic Curve Digital Signature Algorithm (ECDSA), Elliptic Curve Integrated Encryption Scheme (ECIES), Hash Message Authentication Code (HMAC) HMAC-SHA256, Public Key Cryptography, and Unique Secure ID. The LCMXO3D-9400ZC-3BG400I is a Root-of-Trust hardware solution that can easily scale to protect the whole system with its enhanced bitstream security and user mode functions.The LCMXO3D-9400ZC-3BG400I device provides breakthrough I/O density with high number of options for I/O programmability. The device I/O features the support for latest industry standard I/O, including programmable slew-rate enhancements and I3C support.The LCMXO3D-9400ZC-3BG400I of low power, instant-on, Flash based PLDs have two devices with densities of 4300 and 9400 Look-Up Tables (LUTs). MachXO3D devices include on-chip dual boot configuration flash as well as multi-sectored User Flash Memory (UFM). In addition to LUT-based programmable logic, these devices feature Embedded Block RAM (EBR), Distributed RAM, Phase Locked Loops (PLLs), pre-engineered source synchronous I/O support, advanced configuration support including on-chip dual-boot capability and hardened versions of commonly used functions such as SPI controller, I2C controller, and timer/counter.The LCMXO3D-9400ZC-3BG400I are designed on a 65-nm non-volatile low power process. The device architecture has several features such as programmable low swing differential I/O and the ability to turn off I/O banks, on-chip PLLs and oscillators dynamically. These features help manage static and dynamic power consumption resulting in low power for all members of the family.The LCMXO3D-9400ZC-3BG400I devices are available in two performance levels: ultra low power (ZC) and high performance (HC). The ultra low power devices are offered in two speed grades: –2 and –3, with –3 being the fastest. Similarly, the high-performance devices are offered in two speed grades: –5 and –6, with –6 being the fastest. ZC/HC devices have an internal linear voltage regulator, which supports external VCC supply voltages of 3.3 V or 2.5 V. With the exception of power/performance profiles, the two types of devices, ZC and HC, are pin compatible with each other.The LCMXO3D-9400ZC-3BG400I PLDs are available in a broad range of advanced halogen-free packages ranging from the space saving 10 x 10 mm QFN to the 19 x 19 mm caBGA. MachXO3D devices support density migration within the same package.The LCMXO3D-9400ZC-3BG400I offer enhanced I/O features such as drive strength control, finer slew rate control, I3C compatibility, bus-keeper latches, pull-up resistors, pull-down resistors, open drain outputs, and hot socketing. Pull-up, pull-down, and bus-keeper features are controllable on a per-pin basis.A user-programmable internal oscillator is included in MachXO3D devices. The clock output from this oscillator may be divided by the timer or counter for use as clock input in functions such as LED control, key-board scanner, and similar state machines.The LCMXO3D-9400ZC-3BG400I devices also provide flexible, reliable, and secure configuration from on-chip Flash with the encryption and authentication options. These devices can also configure themselves from external SPI Flash or be configured by an external master through the JTAG test access port or through the SPI/I2C port. Additionally, MachXO3D devices support on-chip dual-boot capability to reduce the system cost and remote field upgrade TransFR capability.Lattice Semiconductor provides a variety of design tools that allow complex designs to be efficiently implemented using The LCMXO3D-9400ZC-3BG400I devices. Popular logic synthesis tools provide synthesis library support for MachXO3D devices. Lattice design tools use the synthesis tool output along with the user-specified preferences and constraints to place and route the design in The LCMXO3D-9400ZC-3BG400I device. These tools extract the timing from the routing and back-annotate it into the design for timing verification.Lattice Semiconductor provides many pre-engineered Intellectual Property (IP) LatticeCORETM modules, including a number of reference designs licensed free of charge, optimized for The LCMXO3D-9400ZC-3BG400I PLD. By using these configurable soft core IP cores as standardized blocks, you are free to concentrate on the unique aspects of their design, increasing their productivity.
LCMXO3D-9400ZC-3BG400I Tags integrated circuit
1. Lattice LCMXO3D-9400
2. LCMXO3D-9400 development board
3. Lattice MachXO3D development board
4. MachXO3D LCMXO3D-9400
5. LCMXO3D-9400 evaluation board
6. LCMXO3D-9400ZC-3BG400I Datasheet PDF
7. LCMXO3D-9400 reference design
8. MachXO3D evaluation kit
9. MachXO3D LCMXO3D-9400
Xilinx LCMXO3D-9400ZC-3BG400I TechnicalAttributes