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M1A3PE3000-FG896I FAQ Chips
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ICs M1A3PE3000-FG896I Features
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Xilinx M1A3PE3000-FG896I Overview
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike SRAMbased FPGAs, flash-based ProASIC3E devices allow all functionality to be Instant On; no external boot
PROM is required. On-board security mechanisms prevent access to all the programming information
and enable secure remote updates of the FPGA logic. Designers can perform secure remote in-system
reprogramming to support future design iterations and field upgrades with confidence that valuable
intellectual property (IP) cannot be compromised or copied. Secure ISP can be performed using the
industry-standard AES algorithm. The ProASIC3E family device architecture mitigates the need for ASIC
migration at higher user volumes. This makes the ProASIC3E family a cost-effective ASIC replacement
solution, especially for applications in the consumer, networking/ communications, computing, and
The nonvolatile, flash-based ProASIC3E devices do not require a boot PROM, so there is no vulnerable
external bitstream that can be easily copied. ProASIC3E devices incorporate FlashLock, which provides
a unique combination of reprogrammability and design security without external overhead, advantages
that only an FPGA with nonvolatile flash programming can offer.
The Microsemi Embedded – FPGAs (Field Programmable Gate Array) series M1A3PE3000-FG896I is IC FPGA 620 I/O 896FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
M1A3PE3000-FG896I Tags integrated circuit
1. M1A3PE3000 reference design
2. Cortex-M1 Flash FPGAs M1A3PE3000
3. M1A3PE3000-FG896I Datasheet PDF
4. Microsemi M1A3PE3000
5. M1A3PE3000 development board
6. Cortex-M1 Flash FPGAs evaluation kit
7. M1A3PE3000 evaluation board
8. Microsemi Cortex-M1 Flash FPGAs development board
9. Microsemi M1A3PE3000
Xilinx M1A3PE3000-FG896I TechnicalAttributes
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Package / Case 896-BGA
-Number of Gates 3000000
-Mounting Type Surface Mount
-Supplier Device Package 896-FBGA (31×31)
-Total RAM Bits 516096
-Number of I/O 620
-Voltage – Supply 1.425V ~ 1.575V