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XC4VSX25-10FFG668I FAQ Chips
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ICs XC4VSX25-10FFG668I Features
Flexible Logic Resources
Optional pipeline stages
Secure Chip AES Bitstream Encryption
IBM PowerPC RISC Processor Core [FX only]
Flip-Chip Packaging including Pb-Free Package Choices
PowerPC 405 (PPC405) Core
Multiple Tri-Mode Ethernet MACs [FX only]
Three Families — LX/SX/FX
90 nm Copper CMOS Process
Auxiliary Processor Unit Interface (User Coprocessor)
RocketIO 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]
18 x 18, two’s complement, signed Multiplier
Built-in Accumulator (48-bit) and Adder/Subtracter
1.2V Core Voltage
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Xilinx XC4VSX25-10FFG668I Overview
Combining Advanced Silicon Modular Block (ASMBL) architecture with a wide variety of flexible features, the XC4VSX25-10FFG668I greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC technology. Virtex-4 XC4VSX25-10FFG668I FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices and combinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes the PowerPC processors (with a new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers, dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. Virtex-4 XC4VSX25-10FFG668I devices are produced on a state-of-the-art 90 nm copper process using 300 mm (12-inch) wafer technology.
The Xilinx FPGAs (Field Programmable Gate Array) series XC4VSX25-10FFG668I is CryptoCompanion Chip 8Pin SOIC Bulk, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XC4VSX25-10FFG668I Tags integrated circuit
1. Virtex-4 evaluation kit
2. XC4VSX25 evaluation board
3. XC4VSX25 reference design
4. XC4VSX25 development board
5. Virtex-4 starter kit
6. Xilinx XC4VSX25
7. XC4VSX25-10FFG668I Datasheet PDF
8. Virtex-4 XC4VSX25
9. XC4VSX25 development board
Xilinx XC4VSX25-10FFG668I TechnicalAttributes
-Voltage – Supply 1.14V ~ 1.26V
-Number of LABs/CLBs 2560
-Package / Case 668-BBGA, FCBGA
-Total RAM Bits 2359296
-Supplier Device Package 668-FCBGA (27×27)
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of I/O 320
-Mounting Type Surface Mount
-Number of Logic Elements/Cells 23040