XA3S1000-4FTG256I ApplicationField
-Artificial Intelligence
-Medical Equipment
-Cloud Computing
-5G Technology
-Consumer Electronics
-Industrial Control
-Wireless Technology
-Internet of Things
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XA3S1000-4FTG256I FAQ Chips
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ICs XA3S1000-4FTG256I Features
• Revolutionary 90-nanometer process technology
♦ Eighteen single-ended signal standards
• Low cost, high-performance logic solution for high-volume, automotive applications
♦ Up to 487 I/O pins
♦ Double Data Rate (DDR) support
♦ Wide multiplexers
• Logic resources
• SelectIO interface signaling
♦ Signal swing ranging from 1.14V to 3.45V
♦ Three power rails: for core (1.2V), I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V)
• Guaranteed to meet full electrical specification over the TJ = –40°C to +125°C temperature range
♦ Eight differential signal standards including LVDS
• AEC-Q100 device qualification and full PPAP documentation support available in both extended temperature Q-grade and I-grade
♦ Termination by Digitally Controlled Impedance
♦ 622 Mb/s data transfer rate per I/O
♦ Abundant logic cells with shift register capability
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Xilinx XA3S1000-4FTG256I Overview
The Xilinx XA3S1000-4FTG256I of Field-Programmable Gate Arrays meets the needs of high-volume, cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million system gates.XA devices are available in both extended-temperature Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to +100°C TJ) and are qualified to the industry-recognized AEC-Q100 standard. The XA3S1000-4FTG256I builds on the success of the earlier XA Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XA3S1000-4FTG256I FPGAs are ideally suited to a wide range of advanced automotive electronics modules and systems ranging from the latest driver assistance and infotainment systems to instrument clusters and gateways. The XA3S1000-4FTG256I is a flexible alternative to ASICs, ASSPs, and microcontrollers. FPGAs avoid the high initial NREs, the lengthy development cycles, and problems with obsolescence. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary.
The Xilinx FPGAs (Field Programmable Gate Array) series XA3S1000-4FTG256I is Rechargeable Battery, 12V, Lead Acid, 45Ah, M6 Stud, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XA3S1000-4FTG256I Tags integrated circuit
1. XA3S1000 reference design
2. Xilinx XA3S1000
3. XA3S1000 evaluation board
4. XA Spartan-3 Automotive FPGA starter kit
5. XA3S1000-4FTG256I Datasheet PDF
6. XA3S1000 development board
7. Xilinx XA Spartan-3 Automotive FPGA development board
8. XA Spartan-3 Automotive FPGA evaluation kit
9. XA Spartan-3 Automotive FPGA starter kit
Xilinx XA3S1000-4FTG256I TechnicalAttributes
-Number of LABs/CLBs 1920
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of Logic Elements/Cells 17280
-Number of I/O 173
-Number of Gates 1000000
-Mounting Type Surface Mount
-Total RAM Bits 442368
-Voltage – Supply 1.14V ~ 1.26V
-Supplier Device Package 256-FTBGA (17×17)
-Package / Case 256-LBGA