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XC4VSX35-12FF668C FAQ Chips
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ICs XC4VSX35-12FF668C Features
Three Families — LX/SX/FX
Digital clock manager (DCM) blocks
Virtex-4 LX: High-performance logic applications solution
18 x 18, two’s complement, signed Multiplier
Additional phase-matched clock dividers (PMCD)
Built-in Accumulator (48-bit) and Adder/Subtracter
Optional pipeline stages
Differential global clocks
Virtex-4 SX: High-performance solution for digital signal processing (DSP) applications
Xesium Clock Technology
Virtex-4 FX: High-performance, full-featured solution for embedded platform applications
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Xilinx XC4VSX35-12FF668C Overview
Combining Advanced Silicon Modular Block (ASMBL) architecture with a wide variety of flexible features, the XC4VSX35-12FF668C greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC technology. Virtex-4 XC4VSX35-12FF668C FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices and combinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes the PowerPC processors (with a new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers, dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. Virtex-4 XC4VSX35-12FF668C devices are produced on a state-of-the-art 90 nm copper process using 300 mm (12-inch) wafer technology.
The Xilinx Industrial components series XC4VSX35-12FF668C is FPGA Virtex-4 Family 34560 Cells 90nm (CMOS) Technology 1.2V 668Pin FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC4VSX35-12FF668C Tags integrated circuit
1. Xilinx Virtex-4 development board
2. Xilinx XC4VSX35
3. XC4VSX35 development board
4. Virtex-4 starter kit
5. XC4VSX35 reference design
6. Virtex-4 XC4VSX35
7. Virtex-4 evaluation kit
8. XC4VSX35 evaluation board
9. Virtex-4 starter kit
Xilinx XC4VSX35-12FF668C TechnicalAttributes
-Mounting Type Surface Mount
-Package / Case 668-BBGA, FCBGA
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Total RAM Bits 3538944
-Supplier Device Package 668-FCBGA (27×27)
-Number of LABs/CLBs 3840
-Voltage – Supply 1.14V ~ 1.26V
-Number of I/O 448
-Number of Logic Elements/Cells 34560