XA6SLX25-3FTG256I ApplicationField
-Industrial Control
-Wireless Technology
-Medical Equipment
-Artificial Intelligence
-Cloud Computing
-Internet of Things
-Consumer Electronics
-5G Technology
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XA6SLX25-3FTG256I FAQ Chips
Q: How to obtain XA6SLX25-3FTG256I technical support documents?
A: Enter the “XA6SLX25-3FTG256I” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
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Q: Where can I purchase Xilinx XA6SLX25 Development Boards, Evaluation Boards, or XA Spartan 6 Automotive FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
ICs XA6SLX25-3FTG256I Features
• XA Spartan-6 Family:
• High-performance arithmetic and signal processing
• Multi-port bus structure with independent FIFO to reduce design timing issues
• Automotive Temperatures:
• High-speed GTP serial transceivers in the LXT FPGAs
• DDR, DDR2, DDR3, and LPDDR support
• 45 nm process optimized for cost and low power
• Data rates up to 800 Mb/s
• Suspend mode maintains state and configuration with multipin wake-up, control enhancement
• XA Spartan-6 LX FPGA: Logic optimized
• Optional shift register or distributed RAM support
• 3.3V to 1.2V I/O standards and protocols
• Efficient DSP48A1 slices
• Pipelining and cascading capability
• Hot swap compliance
• Staggered pads
• Enhanced security for design protection
• Multiple efficient integrated blocks
• Beyond AEC-Q100 qualification is available upon request
• Xilinx is ISO-TS16949 compliant
• Hibernate power-down mode for zero power
• High-speed interfaces including: Serial ATA and PCI Express
• Up to 3.2 Gb/s
• I-Grade: Tj = –40°C to +100°C
• Q-Grade: Tj = –40°C to +125°C
• Designed for low cost
• Efficient 6-input LUTs improve performance and minimize power
• Automotive Standards:
• High-volume plastic wire-bonded packages
• Integrated Memory Controller blocks
• Pre-adder to assist filter applications
• Optimized selection of I/O standards
• Multi-voltage, multi-standard SelectIO interface banks
• Selectable output drive, up to 24 mA per pin
bitstreams, using watchdog protection
• Production Part Approval Process (PPAP) documentation
• 2-pin auto-detect configuration
• Adjustable I/O slew rates to improve signal integrity
• Simplified configuration, supports low-cost standards
• MultiBoot support for remote upgrade with multiple
• Broad third-party SPI (up to x4) and NOR flash support
• Low-cost HSTL and SSTL memory interfaces
• XA Spartan-6 LXT FPGA: High-speed serial connectivity
• High performance 1.2V core voltage (LX and LXT FPGAs, -2 and -3 speed grades)
• Low static and dynamic power
• Up to 1,080 Mb/s data transfer rate per differential I/O
• Abundant logic resources with increased logic capacity
• AEC-Q100 qualification
• Fast 18 x 18 multiplier and 48-bit accumulator
Request XA6SLX25-3FTG256I FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XA6SLX25-3FTG256I Overview
The Xilinx Automotive (XA) Spartan-6 family of XA6SLX25-3FTG256I FPGAs provides leading system integration capabilities with the lowest total cost for highvolume automotive applications. The ten-member family delivers expanded densities ranging from 3,840 to 101,261 logic cells and faster, more comprehensive connectivity. Built on a mature 45 nm low-power copper process technology that delivers the optimal balance of cost, power, and performance, the XA6SLX25-3FTG256I offers a new, more efficient, dual-register 6-input look-up table (LUT) logic and a rich selection of built-in system-level blocks. These include 18 Kb (2 x 9 Kb) block RAMs, second generation DSP48A1 slices, SDRAM memory controllers, enhanced mixed-mode clock management blocks, SelectIO technology, power-optimized high-speed serial transceiver blocks, PCI Express compatible Endpoint blocks, advanced system-level power management modes, auto-detect configuration options, and enhanced IP security with AES and Device DNA protection. These features provide a low-cost programmable alternative to custom ASIC products with unprecedented ease of use. XA6SLX25-3FTG256I FPGAs offer the best solution for flexible and scalable high-volume logic designs, high-bandwidth parallel DSP processing designs, and cost-sensitive applications where multiple interfacing standards are required. XA SpartanXA6SLX25-3FTG256I are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components that enable designers to focus on innovation as soon as their development cycle begins
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XA6SLX25-3FTG256I is FPGA XA Spartan-6 Family 24051 Cells 45nm (CMOS) Technology 1.2V 256Pin TFBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XA6SLX25-3FTG256I Tags integrated circuit
1. XA Spartan-6 Automotive FPGA XA6SLX25
2. Xilinx XA6SLX25
3. XA6SLX25-3FTG256I Datasheet PDF
4. XA6SLX25 evaluation board
5. Xilinx XA Spartan-6 Automotive FPGA development board
6. XA6SLX25 development board
7. XA Spartan-6 Automotive FPGA starter kit
8. XA Spartan-6 Automotive FPGA evaluation kit
9. XA6SLX25 evaluation board
Xilinx XA6SLX25-3FTG256I TechnicalAttributes
-Number of LABs/CLBs 1879
-Number of Logic Elements/Cells 24051
-Package / Case 256-LBGA
-Voltage – Supply 1.14V ~ 1.26V
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of I/O 186
-Mounting Type Surface Mount
-Total RAM Bits 958464
-Supplier Device Package 256-FTBGA (17×17)