XC3090-70PP175C ApplicationField
-Cloud Computing
-Medical Equipment
-Industrial Control
-Consumer Electronics
-Artificial Intelligence
-5G Technology
-Wireless Technology
-Internet of Things
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XC3090-70PP175C FAQ Chips
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A: Enter the “XC3090-70PP175C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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ICs XC3090-70PP175C Features
– Low quiescent and active power consumption
– Internal 3-state bus capabilities
– Replaces TTL, MSI, and other PLD logic
• Ideal for a wide range of custom VLSI design tasks
• Extensive Packaging Options
– Compatible arrays ranging from 1,000 to 7,500 gate complexity
– Guaranteed toggle rates of 70 to 325 MHz, logic delays from 9 to 2.2 ns
– Easy design iteration
• Unlimited reprogrammability
• High-performance CMOS static memory technology
– TTL or CMOS input thresholds
– Plastic and ceramic surface-mount and pin-grid· array packages
• Ready for volume production
– Over 20 different packages
– System clock speeds over 80 MHz
– Integrates complete sub-systems into a single package
– Standard, off-the-shelf product availability
– High fan-out signal distribution, low-skew clock nets
• Flexible FPGA architecture
– Thin and Very Thin Quad Flat Pack (TQFP and VQFP) options
– Avoids the NRE, time delay, and risk of conventional masked gate arrays
– 100% factory pre-tested devices
– In-system logic changes
– Extensive register, combinatorial, and 1/0 capabilities
– On-chip crystal oscillator amplifier
Request XC3090-70PP175C FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XC3090-70PP175C Overview
The CMOS XC3090-70PP175C of Logic Cell Array (LCA)
families provide a group of high-performance, high-density, digital integrated circuits. Their regular, extendable,
flexible, user-programmable array architecture is com·
posed of a configuration program store plus three types of
configurable elements: a perimeter of 1/0 Blocks (lOBs), a
core array of Configurable Logic Bocks (CLBs) and re·
sources for interconnection. The general structure of an
LCA XC3090-70PP175C device is shown in XC3090-70PP175C Diagram on the next page. The
XACT development system provides schematic capture
and auto place-and-route for design entry. Logic and
timing simulation, and in-circuit emulation are available as
design verification alternatives. The design editor is used
for interactive design optimization, and to compile the data
pattern that represents the configuration program.
The LCA user logic functions and interconnections are
determined by the configuration program data stored in
internal static memory cells. The program can be loaded in
any of several modes to accommodate various system
requirements. The program data resides externally in an
EEPROM, EPROM or ROM on the application circuit
board, or on a floppy disk or hard disk. On-chip initialization
logic provides for optional automatic loading of program
data at power-up. The companion XC17XX Serial
Configuration PROMs provide a very simple serial config·
uration program storage in a one-lime programmable
package.
XC3090-70PP175C Tags integrated circuit
1. XC3000 Series FPGAs evaluation kit
2. XC3090-70PP175C Datasheet PDF
3. XC3090 development board
4. XC3090 evaluation board
5. Xilinx XC3090
6. XC3000 Series FPGAs XC3090
7. Xilinx XC3000 Series FPGAs development board
8. XC3000 Series FPGAs starter kit
9. XC3090 evaluation board
Xilinx XC3090-70PP175C TechnicalAttributes
