XC3S1200E-5FGG400C -Wireless Technology -Consumer Electronics

XC3S1200E-5FGG400C ApplicationField

-Artificial Intelligence
-Industrial Control
-Cloud Computing
-5G Technology
-Medical Equipment
-Consumer Electronics
-Internet of Things
-Wireless Technology

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XC3S1200E-5FGG400C FAQ Chips 

Q: Where can I purchase Xilinx XC3S1200E Development Boards, Evaluation Boards, or Spartan-3E FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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A: Enter the “XC3S1200E-5FGG400C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: Does the price of XC3S1200E-5FGG400C devices fluctuate frequently?
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ICs XC3S1200E-5FGG400C Features

– Dedicated 18 x 18 multipliers
– Abundant logic cells with shift register capability
– Frequency synthesis
– Fast look-ahead carry logic
– Eighteen single-ended signal standards
– Up to 1,728 Kbits of total block RAM
– Up to 633 I/O pins
– Wide multiplexers
– JTAG logic compatible with IEEE 1149.1/1532
• Digital Clock Manager (four DCMs)
– Eight differential signal standards including LVDS
– Up to 432 Kbits of total distributed RAM
– High-resolution phase shifting
– Clock skew elimination
• SelectRAM hierarchical memory

• SelectIO signaling
– Double Data Rate (DDR) support
• Logic resources

and RSDS

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Xilinx XC3S1200E-5FGG400C Overview

The XC3S1200E-5FGG400C Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The eight-member family offers densities ranging from 50,000 to 5,000,000 system gates, as shown in Datasheet.The XC3S1200E-5FGG400C ncreasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions.These XC3S1200E-5FGG400C FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XC3S1200E-5FGG400C FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection and digital television equipment.The XC3S1200E-5FGG400C is a superior alternative to mask programmed ASICs. avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, XC3S1200E-5FGG400C FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
The Xilinx FPGAs (Field Programmable Gate Array) series XC3S1200E-5FGG400C is Field Programmable Gate Array FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3S1200E-5FGG400C Tags integrated circuit

1. Xilinx Spartan-3E FPGA development board
2. Spartan-3E FPGA starter kit
3. XC3S1200E evaluation board
4. XC3S1200E-5FGG400C Datasheet PDF
5. Spartan-3E FPGA evaluation kit
6. Spartan-3E FPGA XC3S1200E
7. XC3S1200E development board
8. XC3S1200E reference design
9. XC3S1200E-5FGG400C Datasheet PDF

Xilinx XC3S1200E-5FGG400C TechnicalAttributes

-Operating Temperature 0℃ ~ 85℃ (TJ)
-Mounting Type Surface Mount
-Package / Case 400-BGA
-Number of I/O 304
-Voltage – Supply 1.14V ~ 1.26V
-Total RAM Bits 516096
-Number of Logic Elements/Cells 19512

-Number of Gates 1200000
-Number of LABs/CLBs 2168

-Supplier Device Package 400-FBGA (21×21)

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