XC3S1600E-4FGG484C -Consumer Electronics -5G Technology

XC3S1600E-4FGG484C ApplicationField

-Cloud Computing
-Industrial Control
-Internet of Things
-Medical Equipment
-Artificial Intelligence
-5G Technology
-Wireless Technology
-Consumer Electronics

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XC3S1600E-4FGG484C FAQ Chips 

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: Where can I purchase Xilinx XC3S1600E Development Boards, Evaluation Boards, or Spartan-3E FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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ICs XC3S1600E-4FGG484C Features

– Up to 1,728 Kbits of total block RAM
– Up to 432 Kbits of total distributed RAM
– Up to 633 I/O pins
and RSDS
– Wide multiplexers
• SelectRAM hierarchical memory
– Eight differential signal standards including LVDS
– Eighteen single-ended signal standards
– High-resolution phase shifting
• Logic resources
– Double Data Rate (DDR) support
– JTAG logic compatible with IEEE 1149.1/1532
– Abundant logic cells with shift register capability
– Frequency synthesis
• Digital Clock Manager (four DCMs)

– Clock skew elimination
– Dedicated 18 x 18 multipliers
• SelectIO signaling

– Fast look-ahead carry logic

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Xilinx XC3S1600E-4FGG484C Overview

The XC3S1600E-4FGG484C Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications.The Spartan XC3S1600E-4FGG484C increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of configuration. XC3S1600E-4FGG484C combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XC3S1600E-4FGG484C FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment.The XC3S1600E-4FGG484C is a superior alternative to mask programmed ASICs. FPGAs avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
The Xilinx FPGAs series XC3S1600E-4FGG484C is XC3S1600E-4FGG484C, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XC3S1600E-4FGG484C Tags integrated circuit

1. Xilinx Spartan-3E FPGA development board
2. Spartan-3E FPGA evaluation kit
3. Spartan-3E FPGA starter kit
4. Spartan-3E FPGA XC3S1600E
5. XC3S1600E evaluation board
6. Xilinx XC3S1600E
7. XC3S1600E-4FGG484C Datasheet PDF
8. XC3S1600E reference design
9. Spartan-3E FPGA XC3S1600E

Xilinx XC3S1600E-4FGG484C TechnicalAttributes

-Supplier Device Package 484-FBGA (23×23)
-Number of LABs/CLBs 3688
-Voltage – Supply 1.14V ~ 1.26V
-Total RAM Bits 663552
-Mounting Type Surface Mount
-Number of Logic Elements/Cells 33192
-Number of Gates 1600000

-Number of I/O 376
-Operating Temperature 0℃ ~ 85℃ (TJ)

-Package / Case 484-BBGA

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