XC3SD3400A-4FGG676I -5G Technology -Medical Equipment

XC3SD3400A-4FGG676I ApplicationField

-Artificial Intelligence
-Industrial Control
-Cloud Computing
-Internet of Things
-Wireless Technology
-Medical Equipment
-Consumer Electronics
-5G Technology

Request XC3SD3400A-4FGG676I FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now

XC3SD3400A-4FGG676I FAQ Chips 

Q: Where can I purchase Xilinx XC3SD3400A Development Boards, Evaluation Boards, or Spartan-3A DSP FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: How to obtain XC3SD3400A-4FGG676I technical support documents?
A: Enter the “XC3SD3400A-4FGG676I” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: What should I do if I did not receive the technical support for XC3SD3400A4FGG676I in time?
A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XC3SD3400A-4FGG676I pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

Q: Do I have to sign up on the website to make an inquiry for XC3SD3400A-4FGG676I?
A: No, only submit the quantity, email address and other contact information required for the inquiry of XC3SD3400A-4FGG676I, but you need to sign up for the post comments and resource downloads.

Q: Does the price of XC3SD3400A-4FGG676I devices fluctuate frequently?
A: The RAYPCB search engine monitors the XC3SD3400A-4FGG676I inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.

ICs XC3SD3400A-4FGG676I Features

• LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O
• Densities up to 53712 logic cells, including optional shift register
• x8 or x8/x16 BPI parallel NOR Flash PROM
• Efficient wide multiplexers, wide logic, fast carry logic
• Up to 519 I/O pins or 227 differential signal pairs
• QUIETIO standard reduces I/O switching noise
• 622+ Mb/s data transfer rate per differential I/O
• Suspend, Hibernate modes reduce system power
• Available pipeline stages for enhanced performance of at least 250 MHz in the standard -4 speed grade
• Multi-voltage, multi-standard SelectIO interface pins
• High-resolution phase shifting
• IEEE 1149.1/1532 JTAG programming/debug port
• Clock skew elimination (delay locked loop)
• XA Automotive version available
• Hierarchical SelectRAM memory architecture
• Full 3.3V ± 10% compatibility and hot swap compliance
• Wide frequency range (5 MHz to over 320 MHz)
• LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors
• Fully compliant 32-/64-bit, 33/66 MHz PCI support
• Integrated 18-bit pre-adder
• Dedicated 18-bit by 18-bit multiplier
• Very low cost, high-performance DSP solution for high-volume, cost-conscious applications
• 48-bit accumulator for multiply-accumulate (MAC) operation
• Low-cost Xilinx Platform Flash with JTAG
• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing
• Integrated adder for complex multiply or multiply-add operation
• Up to 2268 Kbits of fast block RAM with byte write enables for processor applications
• Low-cost, space-saving SPI serial Flash PROM
• Dual-range VCCAUX supply simplifies 3.3V-only design
• Common footprints support easy density migration
• 250 MHz XtremeDSP DSP48A Slices
• Up to 373 Kbits of efficient distributed RAM
• Load multiple bitstreams under FPGA control
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• MicroBlaze and PicoBlaze embedded processor cores
• Low-power option reduces quiescent current
• DDR/DDR2 SDRAM support up to 333 Mb/s
• Selectable output drive, up to 24 mA per pin
• Registered outputs on the block RAM with operation of at least 280 MHz in the standard -4 speed grade
• Frequency synthesis, multiplication, division
• Unique Device DNA identifier for design authentication
• Optional cascaded Multiply or MAC
• Abundant, flexible logic resources
• BGA and CSP packaging with Pb-free options
• Configuration interface to industry-standard PROMs
• Enhanced Double Data Rate (DDR) support
• Eight Digital Clock Managers (DCMs)
• Post-configuration CRC checking

Request XC3SD3400A-4FGG676I FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now

Xilinx XC3SD3400A-4FGG676I Overview

The XC3SD3400A-4FGG676I of Field-Programmable Gate Arrays
(FPGAs) solves the design challenges in most high- volume,
cost-sensitive, high-performance DSP applications. The
two-member family offers densities ranging from 1.8 to 3.4 million
system gates.
The Spartan-3A DSP family builds on the success of the
Spartan-3A FPGA family by increasing the amount of memory per
logic and adding XtremeDSP DSP48A slices. New features
improve system performance and reduce the cost of configuration.
These Spartan-3A DSP FPGA enhancements, combined with
proven 90 nm process technology, deliver more functionality and
bandwidth per dollar than ever before, setting the new standard in
the programmable logic and DSP processing industry.
The Spartan-3A DSP FPGAs extend and enhance the Spartan-3A
FPGA family. The XC3SD1800A and the XC3SD3400A-4FGG676I devices
are tailored for DSP applications and have additional block RAM
and XtremeDSP DSP48A slices. The XtremeDSP DSP48A slices
replace the 18×18 multipliers found in the Spartan-3A devices and
are based on the DSP48 blocks found in the Virtex-4 devices.
The block RAMs are also enhanced to run faster by adding an
output register. Both the block RAM and DSP48A slices in the
Spartan-3A DSP devices run at 250 MHz in the lowest cost,
standard -4 speed grade.
Because of their exceptional DSP price/performance ratio,
Spartan-3A DSP FPGAs are ideally suited to a wide range of
consumer electronics applications, such as broadband access,
home networking, display/projection, and digital television.
The XC3SD3400A-4FGG676I is a superior alternative to mask
programmed ASICs. FPGAs avoid the high initial cost, lengthy
development cycles, and the inherent inflexibility of conventional
ASICs. Also, FPGA programmability permits design upgrades in
the field with no hardware replacement necessary, an impossibility
with ASICs.
The Xilinx FPGAs series XC3SD3400A-4FGG676I is FPGA Spartan-3A DSP Family 3.4M Gates 53712 Cells 667MHz 90nm Technology 1.2V , View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3SD3400A-4FGG676I Tags integrated circuit

1. Spartan-3A DSP FPGA XC3SD3400A
2. Xilinx XC3SD3400A
3. XC3SD3400A evaluation board
4. Spartan-3A DSP FPGA evaluation kit
5. XC3SD3400A development board
6. Xilinx Spartan-3A DSP FPGA development board
7. XC3SD3400A reference design
8. XC3SD3400A-4FGG676I Datasheet PDF
9. Spartan-3A DSP FPGA evaluation kit

Xilinx XC3SD3400A-4FGG676I TechnicalAttributes

-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of Gates 3400000
-Number of I/O 469
-Total RAM Bits 2322432
-Package / Case 676-BGA
-Mounting Type Surface Mount
-Supplier Device Package 676-FBGA (27×27)

-Number of Logic Elements/Cells 53712
-Voltage – Supply 1.14V ~ 1.26V

-Number of LABs/CLBs 5968

    GET A FREE QUOTE PCB Manufacturing & Assembly Service
    File Upload