XC3SD3400A-FGG676I ApplicationField
-Consumer Electronics
-Internet of Things
-Industrial Control
-Wireless Technology
-Cloud Computing
-5G Technology
-Artificial Intelligence
-Medical Equipment
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XC3SD3400A-FGG676I FAQ Chips
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
ICs XC3SD3400A-FGG676I Features
• DDR/DDR2 SDRAM support up to 333 Mb/s
• LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors
• Post-configuration CRC checking
• Dual-range VCCAUX supply simplifies 3.3V-only design
• IEEE 1149.1/1532 JTAG programming/debug port
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• Optional cascaded Multiply or MAC
• QUIETIO standard reduces I/O switching noise
• Integrated 18-bit pre-adder
• Frequency synthesis, multiplication, division
• Low-cost Xilinx Platform Flash with JTAG
• Multi-voltage, multi-standard SelectIO interface pins
• Unique Device DNA identifier for design authentication
• 250 MHz XtremeDSP DSP48A Slices
• Abundant, flexible logic resources
• Efficient wide multiplexers, wide logic, fast carry logic
• Densities up to 53712 logic cells, including optional shift register
• Hierarchical SelectRAM memory architecture
• High-resolution phase shifting
• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing
• Up to 373 Kbits of efficient distributed RAM
• Up to 2268 Kbits of fast block RAM with byte write enables for processor applications
• 622+ Mb/s data transfer rate per differential I/O
• Up to 519 I/O pins or 227 differential signal pairs
• Configuration interface to industry-standard PROMs
• Very low cost, high-performance DSP solution for high-volume, cost-conscious applications
• Full 3.3V ± 10% compatibility and hot swap compliance
• MicroBlaze and PicoBlaze embedded processor cores
• x8 or x8/x16 BPI parallel NOR Flash PROM
• Clock skew elimination (delay locked loop)
• Low-power option reduces quiescent current
• BGA and CSP packaging with Pb-free options
• Load multiple bitstreams under FPGA control
• 48-bit accumulator for multiply-accumulate (MAC) operation
• XA Automotive version available
• Common footprints support easy density migration
• Suspend, Hibernate modes reduce system power
• Available pipeline stages for enhanced performance of at least 250 MHz in the standard -4 speed grade
• Fully compliant 32-/64-bit, 33/66 MHz PCI support
• Low-cost, space-saving SPI serial Flash PROM
• Eight Digital Clock Managers (DCMs)
• Dedicated 18-bit by 18-bit multiplier
• Wide frequency range (5 MHz to over 320 MHz)
• Enhanced Double Data Rate (DDR) support
• Integrated adder for complex multiply or multiply-add operation
• Selectable output drive, up to 24 mA per pin
• Registered outputs on the block RAM with operation of at least 280 MHz in the standard -4 speed grade
• LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O
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Xilinx XC3SD3400A-FGG676I Overview
The XC3SD3400A-FGG676I of Field-Programmable Gate Arrays
(FPGAs) solves the design challenges in most high- volume,
cost-sensitive, high-performance DSP applications. The
two-member family offers densities ranging from 1.8 to 3.4 million
system gates.
The Spartan-3A DSP family builds on the success of the
Spartan-3A FPGA family by increasing the amount of memory per
logic and adding XtremeDSP DSP48A slices. New features
improve system performance and reduce the cost of configuration.
These Spartan-3A DSP FPGA enhancements, combined with
proven 90 nm process technology, deliver more functionality and
bandwidth per dollar than ever before, setting the new standard in
the programmable logic and DSP processing industry.
The Spartan-3A DSP FPGAs extend and enhance the Spartan-3A
FPGA family. The XC3SD1800A and the XC3SD3400A-FGG676I devices
are tailored for DSP applications and have additional block RAM
and XtremeDSP DSP48A slices. The XtremeDSP DSP48A slices
replace the 18×18 multipliers found in the Spartan-3A devices and
are based on the DSP48 blocks found in the Virtex-4 devices.
The block RAMs are also enhanced to run faster by adding an
output register. Both the block RAM and DSP48A slices in the
Spartan-3A DSP devices run at 250 MHz in the lowest cost,
standard -4 speed grade.
Because of their exceptional DSP price/performance ratio,
Spartan-3A DSP FPGAs are ideally suited to a wide range of
consumer electronics applications, such as broadband access,
home networking, display/projection, and digital television.
The XC3SD3400A-FGG676I is a superior alternative to mask
programmed ASICs. FPGAs avoid the high initial cost, lengthy
development cycles, and the inherent inflexibility of conventional
ASICs. Also, FPGA programmability permits design upgrades in
the field with no hardware replacement necessary, an impossibility
with ASICs.
XC3SD3400A-FGG676I Tags integrated circuit
1. Xilinx Spartan-3A DSP FPGA development board
2. XC3SD3400A reference design
3. XC3SD3400A-FGG676I Datasheet PDF
4. Spartan-3A DSP FPGA XC3SD3400A
5. XC3SD3400A development board
6. Spartan-3A DSP FPGA evaluation kit
7. Spartan-3A DSP FPGA starter kit
8. Xilinx XC3SD3400A
9. Spartan-3A DSP FPGA XC3SD3400A
Xilinx XC3SD3400A-FGG676I TechnicalAttributes