XC4VLX200-10FF1513C -Wireless Technology -5G Technology

XC4VLX200-10FF1513C ApplicationField

-Consumer Electronics
-Cloud Computing
-Industrial Control
-Medical Equipment
-Internet of Things
-5G Technology
-Artificial Intelligence
-Wireless Technology

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XC4VLX200-10FF1513C FAQ Chips 

Q: How to obtain XC4VLX200-10FF1513C technical support documents?
A: Enter the “XC4VLX200-10FF1513C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

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Q: Does the price of XC4VLX200-10FF1513C devices fluctuate frequently?
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: Where can I purchase Xilinx XC4VLX200 Development Boards, Evaluation Boards, or Virtex-4 FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

ICs XC4VLX200-10FF1513C Features

SelectIO Technology
Smart RAM Memory Hierarchy
1.5V to 3.3V I/O operation
High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.
Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals
90 nm Copper CMOS Process
Flexible Logic Resources
Built-in Accumulator (48-bit) and Adder/Subtracter
Dual-port 18-Kbit RAM blocks
Secure Chip AES Bitstream Encryption
1.2V Core Voltage
XtremeDSP Slice
Optional pipeline stages
18 x 18, two’s complement, signed Multiplier
Distributed RAM

Digitally controlled impedance (DCI) active termination
Optional pipeline stages
Fine grained I/O banking (configuration in one bank)

Built-in ChipSync source-synchronous technology

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Xilinx XC4VLX200-10FF1513C Overview

Combining Advanced Silicon Modular Block (ASMBL) architecture with a wide variety of flexible features, the XC4VLX200-10FF1513C greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC technology. Virtex-4 XC4VLX200-10FF1513C FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices and combinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes the PowerPC processors (with a new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers, dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. Virtex-4 XC4VLX200-10FF1513C devices are produced on a state-of-the-art 90 nm copper process using 300 mm (12-inch) wafer technology.
The Xilinx FPGAs series XC4VLX200-10FF1513C is XC4VLX200-10FF1513C, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC4VLX200-10FF1513C Tags integrated circuit

1. Virtex-4 evaluation kit
2. XC4VLX200 evaluation board
3. Virtex-4 XC4VLX200
4. Xilinx XC4VLX200
5. XC4VLX200-10FF1513C Datasheet PDF
6. Xilinx Virtex-4 development board
7. XC4VLX200 reference design
8. XC4VLX200 development board
9. Xilinx XC4VLX200

Xilinx XC4VLX200-10FF1513C TechnicalAttributes

-Total RAM Bits 6193152
-Number of I/O 960
-Mounting Type Surface Mount
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of LABs/CLBs 22272
-Voltage – Supply 1.14V ~ 1.26V
-Package / Case 1513-BBGA, FCBGA

-Number of Logic Elements/Cells 200448
-Supplier Device Package 1513-FCBGA (40×40)

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