XC4VLX60-12FF668C -Industrial Control -Wireless Technology

XC4VLX60-12FF668C ApplicationField

-Consumer Electronics
-Medical Equipment
-Artificial Intelligence
-Internet of Things
-5G Technology
-Wireless Technology
-Cloud Computing
-Industrial Control

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XC4VLX60-12FF668C FAQ Chips 

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: How to obtain XC4VLX60-12FF668C technical support documents?
A: Enter the “XC4VLX60-12FF668C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: Where can I purchase Xilinx XC4VLX60 Development Boards, Evaluation Boards, or Virtex-4 FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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Q: Does the price of XC4VLX60-12FF668C devices fluctuate frequently?
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A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XC4VLX60-12FF668C pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

ICs XC4VLX60-12FF668C Features

90 nm Copper CMOS Process
Flexible Logic Resources
Built-in ChipSync source-synchronous technology
Additional phase-matched clock dividers (PMCD)
XtremeDSP Slice
Digital clock manager (DCM) blocks
Fine grained I/O banking (configuration in one bank)
1.5V to 3.3V I/O operation
Built-in Accumulator (48-bit) and Adder/Subtracter
SelectIO Technology
1.2V Core Voltage
Distributed RAM
Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals
Digitally controlled impedance (DCI) active termination
Differential global clocks
Smart RAM Memory Hierarchy
Optional pipeline stages
Secure Chip AES Bitstream Encryption
18 x 18, two’s complement, signed Multiplier
Xesium Clock Technology
Dual-port 18-Kbit RAM blocks
High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.
Optional pipeline stages

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Xilinx XC4VLX60-12FF668C Overview

Combining Advanced Silicon Modular Block (ASMBL) architecture with a wide variety of flexible features, the XC4VLX60-12FF668C greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC technology. Virtex-4 XC4VLX60-12FF668C FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices and combinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes the PowerPC processors (with a new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers, dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. Virtex-4 XC4VLX60-12FF668C devices are produced on a state-of-the-art 90 nm copper process using 300 mm (12-inch) wafer technology.
The Xilinx FPGAs series XC4VLX60-12FF668C is FPGA Virtex-4 Family 59904 Cells 90nm (CMOS) Technology 1.2V 668Pin FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC4VLX60-12FF668C Tags integrated circuit

1. XC4VLX60 reference design
2. Xilinx XC4VLX60
3. Xilinx Virtex-4 development board
4. Virtex-4 evaluation kit
5. Virtex-4 starter kit
6. XC4VLX60 development board
7. XC4VLX60 evaluation board
8. Virtex-4 XC4VLX60
9. Virtex-4 evaluation kit

Xilinx XC4VLX60-12FF668C TechnicalAttributes

-Number of LABs/CLBs 6656
-Number of I/O 448
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Voltage – Supply 1.14V ~ 1.26V
-Total RAM Bits 2949120
-Supplier Device Package 668-FCBGA (27×27)
-Package / Case 668-BBGA, FCBGA

-Mounting Type Surface Mount
-Number of Logic Elements/Cells 59904