XC6VLX130T-1FFG784C ApplicationField
-Internet of Things
-Industrial Control
-Wireless Technology
-Artificial Intelligence
-Cloud Computing
-Medical Equipment
-5G Technology
-Consumer Electronics
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ICs XC6VLX130T-1FFG784C Features
MMCM blocks provide zero-delay buffering, frequency synthesis, clock-phase shifting, inputjitter filtering, and phase-matched clock division
GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s
1.2 to 2.5V I/O operation
40 nm copper CMOS process technology
36-Kb block RAM/FIFOs
Flexible configuration options
Compatibility across sub-families
Data rates below 480 Mb/s supported by oversampling in FPGA logic.
Virtex-6 SXT FPGAs: Highest signal processing capability with advanced serial connectivity
Advanced DSP48E1 slices
Supports 1000BASE-X PCS/PMA and SGMII using GTX transceivers
Dedicated cascade connections
Advanced, high-performance FPGA Logic
New optional pre-adder to assist filtering applications
Optional bitwise logic functionality
Digitally controlled impedance (DCI) active termination
High-performance parallel SelectIO technology
Powerful mixed-mode clock managers (MMCM)
LXT and SXT devices are footprint compatible in the same package
25 x 18, two`s complement multiplier/accumulator
Virtex-6 LXT FPGAs: High-performance logic with advanced serial connectivity
Lower-power 0.9V core voltage option (-1L speed grade only)
GTX transceivers: up to 6.6 Gb/s
Three sub-families:
Integrated 10/100/1000 Mb/s Ethernet MAC block
Virtex-6 HXT FPGAs: Highest bandwidth serial connectivity
Optional pipelining
Supports MII, GMII, and RGMII using SelectIO technology resources
1.0V core voltage (-1, -2, -3 speed grades only)
High-speed memory interface support with integrated write-leveling capability
High signal-integrity flip-chip packaging available in standard or Pb-free package options
Source-synchronous interfacing using ChipSync technology
Flexible fine-grained I/O banking
2500Mb/s support available
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Xilinx XC6VLX130T-1FFG784C Overview
The XC6VLX130T-1FFG784C FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins. Using the third-generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the Xilinx XC6VLX130T-1FFG784C contain many builtin system-level blocks. These features allow logic designers to build the highest levels of performance and functionality into their FPGAbased systems. Built on a 40 nm state-of-the-art copper process technology, XC6VLX130T-1FFG784C FPGAs are a programmable alternative to custom ASIC technology. offer the best solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high-performance embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.
The Xilinx FPGAs series XC6VLX130T-1FFG784C is FPGA Virtex-6 LXT Family 128000 Cells 40nm (CMOS) Technology 1V, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC6VLX130T-1FFG784C Tags integrated circuit
1. Virtex-6 FPGA evaluation kit
2. Xilinx Virtex-6 FPGA development board
3. Virtex-6 FPGA starter kit
4. Virtex-6 FPGA XC6VLX130T
5. XC6VLX130T reference design
6. XC6VLX130T development board
7. Xilinx XC6VLX130T
8. XC6VLX130T evaluation board
9. Virtex-6 FPGA XC6VLX130T
Xilinx XC6VLX130T-1FFG784C TechnicalAttributes
-Number of Logic Elements/Cells 128000
-Package / Case 784-BBGA, FCBGA
-Number of I/O 400
-Voltage – Supply 0.95V ~ 1.05V
-Number of LABs/CLBs 10000
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Supplier Device Package 784-FCBGA (29×29)
-Mounting Type Surface Mount
-Total RAM Bits 9732096
