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XC6VLX130T-L1FFG784C FAQ Chips
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ICs XC6VLX130T-L1FFG784C Features
2500Mb/s support available
Digitally controlled impedance (DCI) active termination
Flexible configuration options
40 nm copper CMOS process technology
MMCM blocks provide zero-delay buffering, frequency synthesis, clock-phase shifting, inputjitter filtering, and phase-matched clock division
Compatibility across sub-families
Dedicated cascade connections
Virtex-6 LXT FPGAs: High-performance logic with advanced serial connectivity
36-Kb block RAM/FIFOs
Advanced DSP48E1 slices
1.2 to 2.5V I/O operation
Supports MII, GMII, and RGMII using SelectIO technology resources
Flexible fine-grained I/O banking
Data rates below 480 Mb/s supported by oversampling in FPGA logic.
GTX transceivers: up to 6.6 Gb/s
Virtex-6 HXT FPGAs: Highest bandwidth serial connectivity
High-speed memory interface support with integrated write-leveling capability
Advanced, high-performance FPGA Logic
25 x 18, two`s complement multiplier/accumulator
Lower-power 0.9V core voltage option (-1L speed grade only)
GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s
Optional bitwise logic functionality
New optional pre-adder to assist filtering applications
LXT and SXT devices are footprint compatible in the same package
Virtex-6 SXT FPGAs: Highest signal processing capability with advanced serial connectivity
Source-synchronous interfacing using ChipSync technology
Supports 1000BASE-X PCS/PMA and SGMII using GTX transceivers
Powerful mixed-mode clock managers (MMCM)
1.0V core voltage (-1, -2, -3 speed grades only)
High-performance parallel SelectIO technology
Integrated 10/100/1000 Mb/s Ethernet MAC block
High signal-integrity flip-chip packaging available in standard or Pb-free package options
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Xilinx XC6VLX130T-L1FFG784C Overview
The XC6VLX130T-L1FFG784C FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins. Using the third-generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the Xilinx XC6VLX130T-L1FFG784C contain many builtin system-level blocks. These features allow logic designers to build the highest levels of performance and functionality into their FPGAbased systems. Built on a 40 nm state-of-the-art copper process technology, XC6VLX130T-L1FFG784C FPGAs are a programmable alternative to custom ASIC technology. offer the best solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high-performance embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XC6VLX130T-L1FFG784C is Virtex-6 LXT FPGA 400 I/O 784FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC6VLX130T-L1FFG784C Tags integrated circuit
1. XC6VLX130T reference design
2. Virtex-6 FPGA XC6VLX130T
3. Xilinx XC6VLX130T
4. XC6VLX130T-L1FFG784C Datasheet PDF
5. XC6VLX130T evaluation board
6. Virtex-6 FPGA evaluation kit
7. Xilinx Virtex-6 FPGA development board
8. XC6VLX130T development board
9. XC6VLX130T-L1FFG784C Datasheet PDF
Xilinx XC6VLX130T-L1FFG784C TechnicalAttributes
-Number of Logic Elements/Cells 128000
-Supplier Device Package 784-FCBGA (29×29)
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of LABs/CLBs 10000
-Voltage – Supply 0.87V ~ 0.93V
-Number of I/O 400
-Total RAM Bits 9732096
-Mounting Type Surface Mount
-Package / Case 784-BBGA, FCBGA