XC6VLX760-2FF1760C ApplicationField
-Internet of Things
-Wireless Technology
-Artificial Intelligence
-Consumer Electronics
-5G Technology
-Industrial Control
-Medical Equipment
-Cloud Computing
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XC6VLX760-2FF1760C FAQ Chips
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ICs XC6VLX760-2FF1760C Features
Powerful mixed-mode clock managers (MMCM)
Advanced DSP48E1 slices
40 nm copper CMOS process technology
Compatibility across sub-families
Real 6-input look-up table (LUT) technology
Integrated 10/100/1000 Mb/s Ethernet MAC block
MMCM blocks provide zero-delay buffering, frequency synthesis, clock-phase shifting, inputjitter filtering, and phase-matched clock division
LXT and SXT devices are footprint compatible in the same package
GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s
LUT/dual flip-flop pair for applications requiring rich register mix
Gen1 (2.5 Gb/s) and Gen2 (5 Gb/s) support with GTX transceivers
SRL32/dual SRL16 with registered outputs option
64-bit (or two 32-bit) distributed LUT RAM option per 6-input LUT
Flexible configuration options
1.0V core voltage (-1, -2, -3 speed grades only)
Improved routing efficiency
Digitally controlled impedance (DCI) active termination
X1, x2, x4, or x8 lane support per block
High signal-integrity flip-chip packaging available in standard or Pb-free package options
Dual LUT5 (5-input LUT) option
Advanced, high-performance FPGA Logic
Integrated interface blocks for PCI Express designs
High-speed memory interface support with integrated write-leveling capability
GTX transceivers: up to 6.6 Gb/s
Lower-power 0.9V core voltage option (-1L speed grade only)
Source-synchronous interfacing using ChipSync technology
Flexible fine-grained I/O banking
Data rates below 480 Mb/s supported by oversampling in FPGA logic.
Endpoint and Root Port capable
Compliant to the PCI Express Base Specification 2.0
1.2 to 2.5V I/O operation
High-performance parallel SelectIO technology
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Xilinx XC6VLX760-2FF1760C Overview
The XC6VLX760-2FF1760C FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins. Using the third-generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the Xilinx XC6VLX760-2FF1760C contain many builtin system-level blocks. These features allow logic designers to build the highest levels of performance and functionality into their FPGAbased systems. Built on a 40 nm state-of-the-art copper process technology, XC6VLX760-2FF1760C FPGAs are a programmable alternative to custom ASIC technology. offer the best solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high-performance embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XC6VLX760-2FF1760C is Multiplexer/Demultiplexer Bus Switch 1Element CMOS 8IN 16Pin TSSOP T/R, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC6VLX760-2FF1760C Tags integrated circuit
1. Xilinx Virtex-6 FPGA development board
2. XC6VLX760-2FF1760C Datasheet PDF
3. XC6VLX760 development board
4. Virtex-6 FPGA starter kit
5. Xilinx XC6VLX760
6. Virtex-6 FPGA XC6VLX760
7. XC6VLX760 evaluation board
8. Virtex-6 FPGA evaluation kit
9. Virtex-6 FPGA starter kit
Xilinx XC6VLX760-2FF1760C TechnicalAttributes
-Package / Case 1760-BBGA, FCBGA
-Mounting Type Surface Mount
-Number of LABs/CLBs 59280
-Voltage – Supply 0.95V ~ 1.05V
-Supplier Device Package 1760-FCBGA (42.5×42.5)
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Total RAM Bits 26542080
-Number of I/O 1200
-Number of Logic Elements/Cells 758784
