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XC7372-10PQ100C FAQ Chips
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ICs XC7372-10PQ100C Features
• High-performance Erasable Programmable Logic Devices (EPLDs)
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Xilinx XC7372-10PQ100C Overview
The XC7372-10PQ100C Devices employs a unique Dual-Block architecture, which provides high speed operations via Fast Function Blocks and/or high density capability via High Density Function Blocks.Fast Function Blocks (FFBs) provide fast, pin-to-pin speed and logic throughput for critical decoding and ultrafast state machine applications. High-Density Function Blocks (FBs) provide maximum logic density and systemlevel features to implement complex functions with predictable timing for adders and accumulators, wide functions and state machines requiring large numbers of product terms, and other forms of complex logic.
In addition, the XC7372-10PQ100C architecture employs the Universal Interconnect Matrix (UIM) which guarantees 100% interconnect of all internal functions. This interconnect scheme provides constant, short interconnect delays for all routing paths through the UIM. Constant interconnect delays simplify device timing and guarantee design performance, regardless of logic placement within the chip.All XC7372-10PQ100C devices are designed in 0.8µ CMOS EPROM technology.
XC7372-10PQ100C Tags integrated circuit
1. XC7372 evaluation board
2. Xilinx XC7300 CMOS EPLD development board
3. XC7300 CMOS EPLD starter kit
4. XC7372-10PQ100C Datasheet PDF
5. Xilinx XC7372
6. XC7372 reference design
7. XC7300 CMOS EPLD XC7372
8. XC7372 development board
9. XC7372-10PQ100C Datasheet PDF
Xilinx XC7372-10PQ100C TechnicalAttributes
-Number of Signal Pins 84
-Number of Function Blocks 8
-Number of Flip-Flops 126
-Typical 22V10 Equivalent 8
-Number of Macrocells 72
-Number of Fast Inputs 12