XC7A200T-L2FBG676E ApplicationField
-Medical Equipment
-Internet of Things
-Artificial Intelligence
-Industrial Control
-Consumer Electronics
-5G Technology
-Cloud Computing
-Wireless Technology
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XC7A200T-L2FBG676E FAQ Chips
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
ICs XC7A200T-L2FBG676E Features
High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
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Xilinx XC7A200T-L2FBG676E Overview
Xilinx 7 series XC7A200T-L2FBG676E FPGAs families complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7A200T-L2FBG676E FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XC7A200T-L2FBG676E is FPGA, Artix-7, MMCM, PLL, 400 I/O’s, 394 MHz, 215360 Cells, 950 mV to 1.05 V, FCBGA-676, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC7A200T-L2FBG676E Tags integrated circuit
1. XC7A200T evaluation board
2. XC7A200T development board
3. Xilinx Artix-7 FPGA development board
4. Xilinx XC7A200T
5. XC7A200T-L2FBG676E Datasheet PDF
6. Artix-7 FPGA XC7A200T
7. Artix-7 FPGA evaluation kit
8. XC7A200T reference design
9. Xilinx XC7A200T
Xilinx XC7A200T-L2FBG676E TechnicalAttributes
-Number of LABs/CLBs 16825
-Number of I/O 400
-Supplier Device Package 676-FCBGA (27×27)
-Voltage – Supply 0.95V ~ 1.05V
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Mounting Type Surface Mount
-Total RAM Bits 13455360
-Package / Case 676-BBGA, FCBGA
-Number of Logic Elements/Cells 215360
