XC7K325T-1FB900C -Medical Equipment -Cloud Computing

XC7K325T-1FB900C ApplicationField

-Artificial Intelligence
-Internet of Things
-5G Technology
-Industrial Control
-Consumer Electronics
-Cloud Computing
-Wireless Technology
-Medical Equipment

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XC7K325T-1FB900C FAQ Chips 

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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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Q: Where can I purchase Xilinx XC7K325T Development Boards, Evaluation Boards, or Kintex-7 FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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ICs XC7K325T-1FB900C Features

High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

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Xilinx XC7K325T-1FB900C Overview

Kintex-7 XC7K325T-1FB900C : Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7K325T-1FB900C FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

XC7K325T-1FB900C Tags integrated circuit

1. XC7K325T evaluation board
2. XC7K325T-1FB900C Datasheet PDF
3. Xilinx XC7K325T
4. Xilinx Kintex-7 FPGAs development board
5. Kintex-7 FPGAs evaluation kit
6. XC7K325T development board
7. Kintex-7 FPGAs starter kit
8. XC7K325T reference design
9. Xilinx Kintex-7 FPGAs development board

Xilinx XC7K325T-1FB900C TechnicalAttributes

-Operating Temperature 0℃ ~ 85℃ (TJ)
-Mounting Type Surface Mount
-Number of LABs/CLBs 25475
-Number of I/O 500
-Total RAM Bits 16404480
-Voltage – Supply 0.97V ~ 1.03V
-Supplier Device Package 900-FCBGA (31×31)

-Number of Logic Elements/Cells 326080
-Package / Case 900-BBGA, FCBGA