XC7K325T-L2FBG900I -Consumer Electronics -Cloud Computing

XC7K325T-L2FBG900I ApplicationField

-5G Technology
-Medical Equipment
-Internet of Things
-Industrial Control
-Wireless Technology
-Cloud Computing
-Artificial Intelligence
-Consumer Electronics

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XC7K325T-L2FBG900I FAQ Chips 

Q: Where can I purchase Xilinx XC7K325T Development Boards, Evaluation Boards, or Kintex-7 FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: How to obtain XC7K325T-L2FBG900I technical support documents?
A: Enter the “XC7K325T-L2FBG900I” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

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A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XC7K325T-L2FBG900I pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

Q: Does the price of XC7K325T-L2FBG900I devices fluctuate frequently?
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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ICs XC7K325T-L2FBG900I Features

36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.

Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

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Xilinx XC7K325T-L2FBG900I Overview

Kintex-7 XC7K325T-L2FBG900I : Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7K325T-L2FBG900I FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

XC7K325T-L2FBG900I Tags integrated circuit

1. Kintex-7 FPGAs evaluation kit
2. XC7K325T reference design
3. XC7K325T development board
4. Kintex-7 FPGAs starter kit
5. Kintex-7 FPGAs XC7K325T
6. Xilinx XC7K325T
7. XC7K325T-L2FBG900I Datasheet PDF
8. XC7K325T evaluation board
9. Kintex-7 FPGAs starter kit

Xilinx XC7K325T-L2FBG900I TechnicalAttributes

-Mounting Type Surface Mount
-Total RAM Bits 16404480
-Voltage – Supply 0.97V ~ 1.03V
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of I/O 500
-Package / Case 900-BBGA, FCBGA
-Number of LABs/CLBs 25475

-Supplier Device Package 900-FCBGA (31×31)
-Number of Logic Elements/Cells 326080

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