XC7K70T-2FBG484C ApplicationField
-Internet of Things
-Wireless Technology
-Consumer Electronics
-Cloud Computing
-Industrial Control
-5G Technology
-Medical Equipment
-Artificial Intelligence
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XC7K70T-2FBG484C FAQ Chips
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ICs XC7K70T-2FBG484C Features
Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
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Xilinx XC7K70T-2FBG484C Overview
Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:Artix®-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
The Xilinx FPGAs (Field Programmable Gate Array) series XC7K70T-2FBG484C is FPGA, Kintex-7, MMCM, PLL, 185 I/O’s, 710 MHz, 65600 Cells, 970 mV to 1.03 V, FCBGA-484, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC7K70T-2FBG484C Tags integrated circuit
1. Xilinx Kintex-7 FPGAs development board
2. Xilinx XC7K70T
3. XC7K70T-2FBG484C Datasheet PDF
4. XC7K70T development board
5. Kintex-7 FPGAs evaluation kit
6. Kintex-7 FPGAs XC7K70T
7. XC7K70T reference design
8. XC7K70T evaluation board
9. XC7K70T development board
Xilinx XC7K70T-2FBG484C TechnicalAttributes
-Number of Logic Elements/Cells 65600
-Number of LABs/CLBs 5125
-Total RAM Bits 4976640
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Package / Case 484-BBGA, FCBGA
-Voltage – Supply 0.97V ~ 1.03V
-Supplier Device Package 484-FCBGA (23×23)
-Number of I/O 285
-Mounting Type Surface Mount
