XC7VX550T-3FFG1927E -Artificial Intelligence -Internet of Things

XC7VX550T-3FFG1927E ApplicationField

-Medical Equipment
-Consumer Electronics
-5G Technology
-Industrial Control
-Wireless Technology
-Internet of Things
-Cloud Computing
-Artificial Intelligence

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XC7VX550T-3FFG1927E FAQ Chips 

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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ICs XC7VX550T-3FFG1927E Features

A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.
Anti-counterfeiting features
Designed for high performance and lowest power with 28 nm, HKMG, and HPL process.
Long-term availability
Fully leaded (Pb) content
Mask set control
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Full-range extended temperature testing
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
4th Generation Information Assurance and Anti-tamper support
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
Ruggedized packaging

Wire-bond and high signal integrity lidded flip-chip ruggedized packages offering easy migration between family members in the same package. All packages are available in Pb option.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

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Xilinx XC7VX550T-3FFG1927E Overview

Xilinx XC7VX550T-3FFG1927E FPGAs address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the high reliability requirements beyond commercial applications.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7VX550T-3FFG1927E FPGAs enable an unparalleled increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XC7VX550T-3FFG1927E is Virtex-7 FPGA 600 I/O 1927FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC7VX550T-3FFG1927E Tags integrated circuit

1. Virtex-7 FPGAs starter kit
2. XC7VX550T reference design
3. Virtex-7 FPGAs XC7VX550T
4. Xilinx XC7VX550T
5. XC7VX550T development board
6. Xilinx Virtex-7 FPGAs development board
7. Virtex-7 FPGAs evaluation kit
8. XC7VX550T evaluation board
9. Xilinx XC7VX550T

Xilinx XC7VX550T-3FFG1927E TechnicalAttributes

-Number of I/O 600
-Supplier Device Package 1927-FCBGA (45×45)
-Package / Case 1924-BBGA, FCBGA
-Number of Logic Elements/Cells 554240
-Mounting Type Surface Mount
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Voltage – Supply 0.97V ~ 1.03V

-Total RAM Bits 43499520
-Number of LABs/CLBs 43300