XC7Z030-2FFG676I ApplicationField
-Medical Equipment
-Cloud Computing
-Internet of Things
-Industrial Control
-Consumer Electronics
-Wireless Technology
-Artificial Intelligence
-5G Technology
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XC7Z030-2FFG676I FAQ Chips
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: Where can I purchase Xilinx XC7Z030 Development Boards, Evaluation Boards, or Zynq-7000 SoC Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
ICs XC7Z030-2FFG676I Features
• Configurable Logic Blocks (CLB)
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Xilinx XC7Z030-2FFG676I Overview
Please note this product is Non-Cancellable and Non-Returnable (NCNR)
The Xilinx Microprocessors series XC7Z030-2FFG676I is Dual ARM Cortex-A9 MPCore with CoreSight System On Chip (SOC) IC Zynq-7000 Kintex-7 FPGA, 125K Logic Cells 256KB 800MHz 676-FCBGA (27×27), View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC7Z030-2FFG676I Tags integrated circuit
1. Xilinx XC7Z030
2. Xilinx Zynq-7000 SoC development board
3. XC7Z030 evaluation board
4. Zynq-7000 SoC starter kit
5. XC7Z030-2FFG676I Datasheet PDF
6. Zynq-7000 SoC XC7Z030
7. XC7Z030 development board
8. XC7Z030 reference design
9. Zynq-7000 SoC starter kit
Xilinx XC7Z030-2FFG676I TechnicalAttributes
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
-Package / Case 676-BBGA, FCBGA
-Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-RAM Size 256KB
-Peripherals DMA
-Supplier Device Package 676-FCBGA (27×27)
-Primary Attributes Kintex?-7 FPGA, 125K Logic Cells
-Speed 800MHz
-Architecture MCU, FPGA
