XC7Z045-2FBG676I -Wireless Technology -Medical Equipment

XC7Z045-2FBG676I ApplicationField

-Internet of Things
-5G Technology
-Industrial Control
-Cloud Computing
-Artificial Intelligence
-Medical Equipment
-Consumer Electronics
-Wireless Technology

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XC7Z045-2FBG676I FAQ Chips 

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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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ICs XC7Z045-2FBG676I Features

• True Dual-Port
• Programmable I/O delay and SerDes
                                               
Configurable Logic Blocks (CLB)
• Flip-flops
• 1.2V to 3.3V I/O
• Configurable as dual 18 Kb block RAM
• Up to 72 bits wide
• 25-bit pre-adder
DSP Blocks
36 Kb Block RAM
• Look-up tables (LUT)
• Supports LVCMOS, LVDS, and SSTL

• 18 x 25 signed multiply
• Cascadeable adders

Programmable I/O Blocks
• 48-bit adder/accumulator

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Xilinx XC7Z045-2FBG676I Overview

Please note this product is Non-Cancellable and Non-Returnable (NCNR)
The Xilinx Microprocessors series XC7Z045-2FBG676I is Dual ARM Cortex-A9 MPCore with CoreSight System On Chip (SOC) IC Zynq-7000 Kintex-7 FPGA, 350K Logic Cells 256KB 800MHz 676-FCBGA (27×27), View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC7Z045-2FBG676I Tags integrated circuit

1. Zynq-7000 SoC starter kit
2. XC7Z045 reference design
3. Zynq-7000 SoC evaluation kit
4. Xilinx XC7Z045
5. Xilinx Zynq-7000 SoC development board
6. XC7Z045-2FBG676I Datasheet PDF
7. XC7Z045 development board
8. XC7Z045 evaluation board
9. Xilinx XC7Z045

Xilinx XC7Z045-2FBG676I TechnicalAttributes

-Operating Temperature -40℃ ~ 100℃ (TJ)
-Speed 800MHz
-Architecture MCU, FPGA
-Package / Case 676-BBGA, FCBGA
-Primary Attributes Kintex?-7 FPGA, 350K Logic Cells
-Supplier Device Package 676-FCBGA (27×27)
-Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
-RAM Size 256KB

-Peripherals DMA