XCV2000E-6BG560C ApplicationField
-Consumer Electronics
-Medical Equipment
-Wireless Technology
-Cloud Computing
-Artificial Intelligence
-5G Technology
-Industrial Control
-Internet of Things
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ICs XCV2000E-6BG560C Features
RF Data Converter Subsystem Overview
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Xilinx XCV2000E-6BG560C Overview
The Virtex-E FPGA family’s XCV2000E-6BG560C delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 μm CMOS process. These advances make Virtex-E FPGAs powerful and flexible alternatives to mask-programmed gate arrays.
Building on experience gained from Virtex FPGAs, the XCV2000E-6BG560C is an evolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the Virtex-E family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
The Xilinx Condensateurs électrolytiques en aluminium series XCV2000E-6BG560C is Virtex-E 1.8 V Field Programmable Gate Arrays FPGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCV2000E-6BG560C Tags integrated circuit
1. Virtex-E 1.8V FPGAs evaluation kit
2. Xilinx XCV2000E
3. XCV2000E evaluation board
4. XCV2000E reference design
5. Xilinx Virtex-E 1.8V FPGAs development board
6. Virtex-E 1.8V FPGAs XCV2000E
7. XCV2000E-6BG560C Datasheet PDF
8. Virtex-E 1.8V FPGAs starter kit
9. XCV2000E reference design
Xilinx XCV2000E-6BG560C TechnicalAttributes
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Voltage – Supply 1.71V ~ 1.89V
-Number of LABs/CLBs 9600
-Number of I/O 404
-Total RAM Bits 655360
-Number of Gates 2541952
-Number of Logic Elements/Cells 43200
-Package / Case 560-LBGA Exposed Pad, Metal
-Mounting Type Surface Mount
-Supplier Device Package 560-MBGA (42.5×42.5)
