XCV812E-8FG900C ApplicationField
-Internet of Things
-Consumer Electronics
-Artificial Intelligence
-Cloud Computing
-Industrial Control
-Wireless Technology
-Medical Equipment
-5G Technology
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XCV812E-8FG900C FAQ Chips
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ICs XCV812E-8FG900C Features
RF Data Converter Subsystem Overview
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Xilinx XCV812E-8FG900C Overview
The XCV812E-8FG900C delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 μm CMOS process. the XCV812E-8FG900C delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
The Xilinx Microcontrôlleur series XCV812E-8FG900C is Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XCV812E-8FG900C Tags integrated circuit
1. Xilinx XCV812E
2. XCV812E evaluation board
3. Virtex-EM 1.8V FPGAs XCV812E
4. Xilinx Virtex-EM 1.8V FPGAs development board
5. XCV812E reference design
6. Virtex-EM 1.8V FPGAs starter kit
7. Virtex-EM 1.8V FPGAs evaluation kit
8. XCV812E-8FG900C Datasheet PDF
9. Xilinx Virtex-EM 1.8V FPGAs development board
Xilinx XCV812E-8FG900C TechnicalAttributes
-Number of Logic Elements/Cells 21168
-Number of LABs/CLBs 4704
-Total RAM Bits 1146880
-Number of I/O 556
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Mounting Type Surface Mount
-Voltage – Supply 1.71V ~ 1.89V
-Package / Case 900-BBGA
-Number of Gates 254016
-Supplier Device Package 900-FBGA (31×31)