XCVU125-H1FLVC2104E -Industrial Control -5G Technology

XCVU125-H1FLVC2104E ApplicationField

-Cloud Computing
-Wireless Technology
-Consumer Electronics
-Artificial Intelligence
-Medical Equipment
-5G Technology
-Internet of Things
-Industrial Control

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XCVU125-H1FLVC2104E FAQ Chips 

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Q: Where can I purchase Xilinx XCVU125 Development Boards, Evaluation Boards, or Virtex UltraScale FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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Q: How to obtain XCVU125-H1FLVC2104E technical support documents?
A: Enter the “XCVU125-H1FLVC2104E” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: Does the price of XCVU125-H1FLVC2104E devices fluctuate frequently?
A: The RAYPCB search engine monitors the XCVU125-H1FLVC2104E inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.

ICs XCVU125-H1FLVC2104E Features

Processing System

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Xilinx XCVU125-H1FLVC2104E Overview

Xilinx UltraScale architecture comprises high-performance FPGA and MPSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.Kintex UltraScale XCVU125-H1FLVC2104E FPGAs: XCVU125-H1FLVC2104E FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.Kintex UltraScale+ FPGAs: Based on the UltraScale architecture, these XCVU125-H1FLVC2104E devices have increased performance and on-chip UltraRAM memory to reduce BOM cost, providing the ideal mix of high-performance peripherals and cost-effective system implementation. In addition, Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.Virtex UltraScale+ FPGAs: Based on the UltraScale architecture, these devices have the highest transceiver bandwidth, highest DSP count, and highest on-chip memory available in the industry for the ultimate in system performance. In addition, Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.the XCVU125-H1FLVC2104E provide unprecedented power savings, processing, programmable acceleration, I/O, and memory bandwidth ideal for applications that require heterogeneous processing.

XCVU125-H1FLVC2104E Tags integrated circuit

1. Xilinx Virtex UltraScale FPGA development board
2. XCVU125-H1FLVC2104E Datasheet PDF
3. XCVU125 evaluation board
4. Xilinx XCVU125
5. Virtex UltraScale FPGA XCVU125
6. XCVU125 reference design
7. XCVU125 development board
8. Virtex UltraScale FPGA evaluation kit
9. Xilinx XCVU125

Xilinx XCVU125-H1FLVC2104E TechnicalAttributes

-Voltage – Supply 0.922V ~ 1.030V
-Number of LABs/CLBs 89520
-Package / Case 2104-BBGA, FCBGA
-Number of Logic Elements/Cells 1566600
-Number of I/O 416
-Mounting Type Surface Mount
-Total RAM Bits 90726400

-Supplier Device Package 2104-FCBGA (47.5×47.5)
-Operating Temperature 0℃ ~ 100℃ (TJ)

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