XQ2V6000-6FF1517N ApplicationField
-Wireless Technology
-5G Technology
-Artificial Intelligence
-Consumer Electronics
-Cloud Computing
-Industrial Control
-Medical Equipment
-Internet of Things
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XQ2V6000-6FF1517N FAQ Chips
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ICs XQ2V6000-6FF1517N Features
• High-performance interfaces to external memory
• Proprietary high-performance SelectLink Technology
• Lightning Data Transport (LDT) I/O with current driver buffers
• Internal 3-state busing
• Built-in DDR input and output registers
• 2.5 Mb of dual-port RAM in 18 Kbit block SelectRAM resources
• 300+ MHz internal clock speed (Advance Data)
• Up to 824 user I/Os
– Double Data Rate (DDR) link
– Precise clock de-skew
• Ceramic and plastic wire-bond and flip-chip grid array packages
• IP-immersion architecture
• Guaranteed over the full military temperature range
• Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O
• Up to 12 DCM (Digital Clock Manager) modules
• Active interconnect technology
• 16 global clock multiplexer buffers
• Fourth-generation segmented routing structure
• Densities from 1M to 6M system gates
• Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards
– High-bandwidth data path
• Up to 1 Mb of distributed SelectRAM resources
– High-resolution phase shifting
• Predictable, fast routing delay, independent of fanout
• 622+ Mb/s I/O (Advance Data)
• High-performance clock management circuitry
– Web-based HDL generation methodology
• 622 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers
• Supported by Xilinx Foundation Series and Alliance
– Flexible frequency synthesis
(–40°C to +100°C)
• SelectIO-Ultra Technology
• 19 single-ended and six differential standards
• PCI compliant (32/33 MHz) at 3.3V
• Programmable sink current (2 mA to 24 mA) per I/O
• Bus LVDS I/O
• SelectRAM Memory Hierarchy
• Differential signaling
(–55°C to +125°C) or industrial temperature range
Request XQ2V6000-6FF1517N FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XQ2V6000-6FF1517N Overview
The XQ2V6000-6FF1517N is a platform FPGA developed for high performance from low-density to high-density designs that are based on IP cores and customized modules. The family delivers complete solutions for telecommunication, wireless, networking, video, and DSP applications, including PCI, LVDS, and DDR interfaces.The leading-edge 0.15 µm / 0.12 µm CMOS 8-layer metal process and the Virtex-II architecture are optimized for high speed with low power consumption. Combining a wide variety of flexible features and a large range of densities up to 10 million system gates, the XQ2V6000-6FF1517N enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gates arrays.
XQ2V6000-6FF1517N Tags integrated circuit
1. QPro Virtex-II 1.5V Platform FPGAs XQ2V6000
2. Xilinx XQ2V6000
3. Xilinx QPro Virtex-II 1.5V Platform FPGAs development board
4. QPro Virtex-II 1.5V Platform FPGAs evaluation kit
5. QPro Virtex-II 1.5V Platform FPGAs starter kit
6. XQ2V6000 evaluation board
7. XQ2V6000-6FF1517N Datasheet PDF
8. XQ2V6000 development board
9. QPro Virtex-II 1.5V Platform FPGAs evaluation kit
Xilinx XQ2V6000-6FF1517N TechnicalAttributes