XQ7Z030-1RF676Q ApplicationField
-Wireless Technology
-Consumer Electronics
-Internet of Things
-5G Technology
-Industrial Control
-Cloud Computing
-Medical Equipment
-Artificial Intelligence
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XQ7Z030-1RF676Q FAQ Chips
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ICs XQ7Z030-1RF676Q Features
PCI Express Block
JTAG Boundary-Scan
• Two 10/100/1000 tri-speed Ethernet MAC peripherals with
• Two SD/SDIO 2.0/MMC3.31 compliant controllers
• 1-bit SPI, 2-bit SPI, 4-bit SPI (quad-SPI), or two quad-SPI (8-bit)
• Cascadable adders
• GPIO with four 32-bit banks, of which 54 bits can be used with the PS
• Flip-flops
• 54 flexible multiplexed I/O (MIO) for peripheral pin assignments
and scatter-gather transaction support
Serial Transceivers
I/O (one bank of 32b and one bank of 22b) and up to 64 bits (up to
• ECC support in 16-bit mode
Configurable Logic Blocks (CLB)
compliant
36 Kb Block RAM
serial NOR flash
Dual-core ARM Cortex-A9 Based Application
• Anti-counterfeiting features
• Two full-duplex SPI ports with three peripheral chip selects
• Supports on-the-go, high-speed, full-speed, and low-speed
• Single and double precision Vector Floating Point Unit (VFPU)
Two 12-Bit Analog-to-Digital Converters
Interconnect
• Fully leaded (Pb) content
On-Chip Memory
• Intel EHCI compliant USB host
• 18 x 25 signed multiply
• Two triple-timer counters Caches
• Parallel NOR flash support
• 32 KB Level 1 4-way set-associative instruction and data caches (independent for each CPU)
• Supports up to Gen2 speeds
• Supports up to 10.3125 Gb/s data rates
• CoreSight and Program Trace Macrocell (PTM)
• Static memory interfaces
• 1.2V to 3.3V I/O
• Full-range extended temperature testing
• One million samples per second maximum conversion rate
• High-bandwidth connectivity within PS and between PS and PL
• Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints
• 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2 memories
• Supports up to 8 lanes
• Byte-parity support
8-Channel DMA Controller
• On-chip voltage and temperature sensing
Processor Unit (APU)
• Thumb-2 instruction set
• 2.5 DMIPS/MHz per CPU
• GMII, RGMII, and SGMII interfaces
• Byte-parity support
modes
• CPU frequency: Up to 800 MHz
memories
• Three watchdog timers
Programmable I/O Blocks
• Up to 17 external differential input channels
• Supports LVCMOS, LVDS, and SSTL
• Ruggedized packaging (RB, RF)
• 512 KB 8-way set-associative Level 2 cache (shared between the CPUs)
• Two high-speed UARTs (up to 1 Mb/s)
• Long-term availability
• Two master and slave I2C interfaces
• Multiprotocol dynamic memory controller
• Configurable as dual 18 Kb
• Coherent multiprocessor support
• ARM AMBA AXI based
• Mask set control
• On-chip boot ROM
• ARMv7-A architecture
• Fourth-generation information assurance and anti-tamper support
• Timer and Interrupts
• 48-bit adder/accumulator
I/O Peripherals and Interfaces
IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support
• Two full CAN 2.0B compliant CAN bus interfaces
• Scatter-gather DMA capability
two banks of 32b) connected to the Programmable Logic
• Look-up tables (LUT)
• True Dual-Port
• NEON media-processing engine
• Recognition of 1588 rev. 2 PTP frames
• 256 KB on-chip RAM (OCM)
Programmable Logic (PL)
• 8-bit SRAM data bus with up to 64 MB support
• External PHY interface
• Up to 72 bits wide
• Programmable I/O delay and SerDes
• 25-bit pre-adder
DSP Blocks
• TrustZone security
• IEEE Std 1149.1 Compatible Test Interface
External Memory Interfaces
• Jazelle RCT execution Environment Architecture
• CAN 2.0-A and CAN 2.0-B and ISO 118981-1 standard
• Supports Root Complex and End Point configurations
• One global timer
• ONFI1.0 NAND flash support (1-bit ECC)
• 1GB of address space using single rank of 8-, 16-, or 32-bit-wide
• USB 2.0 compliant device IP core
• Up to 16 receivers and transmitters
• 8-bit ULPI external PHY interface
• Memory-to-memory, memory-to-peripheral, peripheral-to-memory,
• QoS support on critical masters for latency and bandwidth control
Request XQ7Z030-1RF676Q FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XQ7Z030-1RF676Q Overview
The XQ7Z030-1RF676Q device is based on the Xilinx SoC architecture. The XQ7Z030-1RF676Q of Zynq-7000Q SoC family integrates a feature-rich dual-core ARM
Cortex-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device for extreme environment
applications such as Aerospace and Defense. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory,
external memory interfaces, and a rich set of peripheral connectivity interfaces.
XQ7Z030-1RF676Q Tags integrated circuit
1. XQ7Z030 reference design
2. Defense-grade Zynq-7000Q SoC starter kit
3. XQ7Z030 evaluation board
4. Xilinx XQ7Z030
5. Xilinx Defense-grade Zynq-7000Q SoC development board
6. XQ7Z030-1RF676Q Datasheet PDF
7. Defense-grade Zynq-7000Q SoC evaluation kit
8. XQ7Z030 development board
9. Xilinx XQ7Z030
Xilinx XQ7Z030-1RF676Q TechnicalAttributes
