XQR4036XL-3CB228M ApplicationField
-Internet of Things
-Industrial Control
-Artificial Intelligence
-Consumer Electronics
-5G Technology
-Cloud Computing
-Wireless Technology
-Medical Equipment
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XQR4036XL-3CB228M FAQ Chips
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ICs XQR4036XL-3CB228M Features
Virtually unlimited number of clock signals
Processed on Xilinx QML line
Available in -3 speed
Fully automatic mapping, placement and routing
Hierarchy of interconnect lines
Readback capability
Program verification
Internal node observability
dual-port RAM option
Eight global low-skew clock or signal distribution networks
Wide edge decoders on each edge
Interfaces to popular design environments
Configured by loading binary file
Unlimited reprogrammability
Interactive design editor for design optimization
System performance beyond 60 MHz
Low soft upset rate
Flexible array architecture
Guaranteed total ionizing dose
Radiation-hardened FPGAs for space and satellite applications
Latch-up immune
Improved VersaRing I/O interconnect for better fixed pinout flexibility
Virtually unlimited number of clock signals
IEEE 1149.1-compatible boundary scan logic support
Unlimited reprogrammability
Advanced 0.35µ process
Highest capacity: over 130,000 usable gates
Guaranteed to meet full electrical specifications over –55°C to +125°C
Optional multiplexer or 2-input function generator on device outputs
Internal 3-state bus capability
Programmable input pull-up or pull-down resistors
Program verification
12 mA sink current per output
Internal node observability
5V tolerant I/Os
Abundant flip-flops
Flexible function generators
Individually programmable output slew rate
Buffered interconnect for maximum speed
New latch capability in configurable logic blocks
Development system runs on most common computer platforms
Interfaces to popular design environments
Fully automatic mapping, placement and routing
Interactive design editor for design optimization
Systems-oriented features
IEEE 1149.1-compatible boundary scan logic support
Individually programmable output slew rate
Programmable input pull-up or pull-down resistors
12 mA sink current per output
synchronous write option
SelectRAM memory: on-chip ultra-fast RAM with
synchronous write option
dual-port RAM option
Dedicated high-speed carry logic
System featured FPGAs
SelectRAM memory: on-chip ultra-fast RAM with
synchronous write option
dual-port RAM option
Abundant flip-flops
Flexible function generators
Dedicated high-speed carry logic
Wide edge decoders on each edge
Hierarchy of interconnect lines
Internal 3-state bus capability
Eight global low-skew clock or signal distribution networks
Low power segmented routing architecture
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Xilinx XQR4036XL-3CB228M Overview
Power-On Power Supply Requirements
Xilinx FPGAs require a minimum rated power supply current
capacity to insure proper initialization, and the power supply
ramp-up time does affect the current required. A fast
ramp-up time requires more current than a slow ramp-up
time. The slowest ramp-up time is 50 ms. Current capacity
is not specified for a ramp-up time faster than 2 ms. The current capacity varies linealy with ramp-up time, e.g., an
XQR4036XL-3CB228M with a ramp-up time of 25 ms would require a
capacity predicted by the point on the straight line drawn
from 1A at 120 µs to 500 mA at 50 ms at the 25 ms time
mark. This point is approximately 750 mA .
XQR4000XL AC Switching Characteristic
Testing of the switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values where one global clock input
drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by
the global clock net.
When fewer vertical clock lines are connected, the clock distribution is faster; when multiple clock lines per column are driven from the same global clock, the delay is longer. For
more specific, more precise, and worst-case guaranteed
data, reflecting the actual routing structure, use the values
provided by the static timing analyzer (TRCE in the Xilinx
Development System) and back-annotated to the simulation
netlist. These path delays, provided as a guideline, have
been extracted from the static timing analyzer report. All
timing parameters assume worst-case operating conditions
(supply voltage and junction temperature)
XQR4000XL CLB Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all XQR4000XL devices and expressed in nanoseconds unless otherwise noted.
The Xilinx FPGAS series XQR4036XL-3CB228M is Field Programmable Gate Array (FPGA), View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XQR4036XL-3CB228M Tags integrated circuit
1. QPRO XQR4000XL Radiation Hardened FPGAs XQR4036XL
2. Xilinx QPRO XQR4000XL Radiation Hardened FPGAs development board
3. XQR4036XL development board
4. Xilinx XQR4036XL
5. QPRO XQR4000XL Radiation Hardened FPGAs evaluation kit
6. XQR4036XL reference design
7. XQR4036XL-3CB228M Datasheet PDF
8. XQR4036XL evaluation board
9. Xilinx XQR4036XL
Xilinx XQR4036XL-3CB228M TechnicalAttributes