XQR4062XL-1CB228M -Consumer Electronics -5G Technology

XQR4062XL-1CB228M ApplicationField

-Internet of Things
-Industrial Control
-Wireless Technology
-Medical Equipment
-Artificial Intelligence
-5G Technology
-Cloud Computing
-Consumer Electronics

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XQR4062XL-1CB228M FAQ Chips 

Q: How to obtain XQR4062XL-1CB228M technical support documents?
A: Enter the “XQR4062XL-1CB228M” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: Where can I purchase Xilinx XQR4062XL Development Boards, Evaluation Boards, or QPRO XQR4000XL Radiation Hardened FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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ICs XQR4062XL-1CB228M Features

Readback capability
Low soft upset rate
Low power segmented routing architecture
System performance beyond 60 MHz
Development system runs on most common computer platforms
Internal node observability
Flexible array architecture
Configured by loading binary file
Latch-up immune
Abundant flip-flops
IEEE 1149.1-compatible boundary scan logic support
synchronous write option
Programmable input pull-up or pull-down resistors
Guaranteed to meet full electrical specifications over –55°C to +125°C
Program verification
Processed on Xilinx QML line
12 mA sink current per output
Available in -3 speed
Radiation-hardened FPGAs for space and satellite applications
Individually programmable output slew rate
Eight global low-skew clock or signal distribution networks
Advanced 0.35µ process
Hierarchy of interconnect lines
Flexible function generators
Guaranteed total ionizing dose
Internal 3-state bus capability
Systems-oriented features
Unlimited reprogrammability
Wide edge decoders on each edge
SelectRAM memory: on-chip ultra-fast RAM with
dual-port RAM option
System featured FPGAs
Dedicated high-speed carry logic

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Xilinx XQR4062XL-1CB228M Overview

Power-On Power Supply Requirements
Xilinx XQR4062XL-1CB228M FPGAs require a minimum rated power supply current
capacity to insure proper initialization, and the power supply
ramp-up time does affect the current required. A fast
ramp-up time requires more current than a slow ramp-up
time. The slowest ramp-up time is 50 ms. Current capacity
is not specified for a ramp-up time faster than 2 ms. The current capacity varies linealy with ramp-up time, e.g., an
XQR4036XL with a ramp-up time of 25 ms would require a
capacity predicted by the point on the straight line drawn
from 1A at 120 µs to 500 mA at 50 ms at the 25 ms time
mark. This point is approximately 750 mA .XQR4062XL-1CB228M AC Switching Characteristic Testing of the switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values where one global clock input
drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by
the global clock net.
When fewer vertical clock lines are connected, the clock distribution is faster; when multiple clock lines per column are driven from the same global clock, the delay is longer. For
more specific, more precise, and worst-case guaranteed
data, reflecting the actual routing structure, use the values
provided by the static timing analyzer (TRCE in the Xilinx
Development System) and back-annotated to the simulation
netlist. These path delays, provided as a guideline, have
been extracted from the static timing analyzer report. All
timing parameters assume worst-case operating conditions
(supply voltage and junction temperature)XQR4062XL-1CB228M CLB Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all XQR4000XL devices and expressed in nanoseconds unless otherwise noted.

XQR4062XL-1CB228M Tags integrated circuit

1. QPRO XQR4000XL Radiation Hardened FPGAs evaluation kit
2. Xilinx XQR4062XL
3. XQR4062XL-1CB228M Datasheet PDF
4. QPRO XQR4000XL Radiation Hardened FPGAs starter kit
5. QPRO XQR4000XL Radiation Hardened FPGAs XQR4062XL
6. XQR4062XL development board
7. Xilinx QPRO XQR4000XL Radiation Hardened FPGAs development board
8. XQR4062XL reference design
9. QPRO XQR4000XL Radiation Hardened FPGAs starter kit

Xilinx XQR4062XL-1CB228M TechnicalAttributes

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