XQR4062XL-2CB228I ApplicationField
-Consumer Electronics
-Industrial Control
-Internet of Things
-Cloud Computing
-Medical Equipment
-Wireless Technology
-5G Technology
-Artificial Intelligence
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XQR4062XL-2CB228I FAQ Chips
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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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ICs XQR4062XL-2CB228I Features
12 mA sink current per output
Advanced 0.35µ process
Dedicated high-speed carry logic
Abundant flip-flops
Processed on Xilinx QML line
Guaranteed to meet full electrical specifications over –55°C to +125°C
Program verification
System featured FPGAs
Low power segmented routing architecture
Available in -3 speed
Wide edge decoders on each edge
synchronous write option
SelectRAM memory: on-chip ultra-fast RAM with
Unlimited reprogrammability
Eight global low-skew clock or signal distribution networks
Individually programmable output slew rate
Flexible array architecture
Development system runs on most common computer platforms
System performance beyond 60 MHz
Configured by loading binary file
Hierarchy of interconnect lines
IEEE 1149.1-compatible boundary scan logic support
Low soft upset rate
Radiation-hardened FPGAs for space and satellite applications
Internal node observability
Latch-up immune
Internal 3-state bus capability
Guaranteed total ionizing dose
dual-port RAM option
Programmable input pull-up or pull-down resistors
Systems-oriented features
Readback capability
Flexible function generators
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Xilinx XQR4062XL-2CB228I Overview
Power-On Power Supply Requirements
Xilinx XQR4062XL-2CB228I FPGAs require a minimum rated power supply current
capacity to insure proper initialization, and the power supply
ramp-up time does affect the current required. A fast
ramp-up time requires more current than a slow ramp-up
time. The slowest ramp-up time is 50 ms. Current capacity
is not specified for a ramp-up time faster than 2 ms. The current capacity varies linealy with ramp-up time, e.g., an
XQR4036XL with a ramp-up time of 25 ms would require a
capacity predicted by the point on the straight line drawn
from 1A at 120 µs to 500 mA at 50 ms at the 25 ms time
mark. This point is approximately 750 mA .XQR4062XL-2CB228I AC Switching Characteristic Testing of the switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values where one global clock input
drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by
the global clock net.
When fewer vertical clock lines are connected, the clock distribution is faster; when multiple clock lines per column are driven from the same global clock, the delay is longer. For
more specific, more precise, and worst-case guaranteed
data, reflecting the actual routing structure, use the values
provided by the static timing analyzer (TRCE in the Xilinx
Development System) and back-annotated to the simulation
netlist. These path delays, provided as a guideline, have
been extracted from the static timing analyzer report. All
timing parameters assume worst-case operating conditions
(supply voltage and junction temperature)XQR4062XL-2CB228I CLB Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all XQR4000XL devices and expressed in nanoseconds unless otherwise noted.
XQR4062XL-2CB228I Tags integrated circuit
1. XQR4062XL evaluation board
2. XQR4062XL development board
3. QPRO XQR4000XL Radiation Hardened FPGAs XQR4062XL
4. Xilinx QPRO XQR4000XL Radiation Hardened FPGAs development board
5. Xilinx XQR4062XL
6. XQR4062XL-2CB228I Datasheet PDF
7. QPRO XQR4000XL Radiation Hardened FPGAs evaluation kit
8. QPRO XQR4000XL Radiation Hardened FPGAs starter kit
9. Xilinx QPRO XQR4000XL Radiation Hardened FPGAs development board
Xilinx XQR4062XL-2CB228I TechnicalAttributes