XQR4062XL-3CB228I ApplicationField
-Industrial Control
-Wireless Technology
-Medical Equipment
-Internet of Things
-5G Technology
-Consumer Electronics
-Cloud Computing
-Artificial Intelligence
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XQR4062XL-3CB228I FAQ Chips
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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Q: Where can I purchase Xilinx XQR4062XL Development Boards, Evaluation Boards, or QPRO XQR4000XL Radiation Hardened FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
ICs XQR4062XL-3CB228I Features
Processed on Xilinx QML line
Low soft upset rate
Programmable input pull-up or pull-down resistors
Internal node observability
Abundant flip-flops
Individually programmable output slew rate
Latch-up immune
IEEE 1149.1-compatible boundary scan logic support
Systems-oriented features
System performance beyond 60 MHz
Development system runs on most common computer platforms
Unlimited reprogrammability
dual-port RAM option
Dedicated high-speed carry logic
12 mA sink current per output
Wide edge decoders on each edge
Guaranteed total ionizing dose
Radiation-hardened FPGAs for space and satellite applications
Program verification
System featured FPGAs
Low power segmented routing architecture
synchronous write option
Internal 3-state bus capability
Flexible array architecture
Hierarchy of interconnect lines
SelectRAM memory: on-chip ultra-fast RAM with
Flexible function generators
Advanced 0.35µ process
Readback capability
Available in -3 speed
Configured by loading binary file
Guaranteed to meet full electrical specifications over –55°C to +125°C
Eight global low-skew clock or signal distribution networks
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Xilinx XQR4062XL-3CB228I Overview
Power-On Power Supply Requirements
Xilinx XQR4062XL-3CB228I FPGAs require a minimum rated power supply current
capacity to insure proper initialization, and the power supply
ramp-up time does affect the current required. A fast
ramp-up time requires more current than a slow ramp-up
time. The slowest ramp-up time is 50 ms. Current capacity
is not specified for a ramp-up time faster than 2 ms. The current capacity varies linealy with ramp-up time, e.g., an
XQR4036XL with a ramp-up time of 25 ms would require a
capacity predicted by the point on the straight line drawn
from 1A at 120 µs to 500 mA at 50 ms at the 25 ms time
mark. This point is approximately 750 mA .XQR4062XL-3CB228I AC Switching Characteristic Testing of the switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values where one global clock input
drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by
the global clock net.
When fewer vertical clock lines are connected, the clock distribution is faster; when multiple clock lines per column are driven from the same global clock, the delay is longer. For
more specific, more precise, and worst-case guaranteed
data, reflecting the actual routing structure, use the values
provided by the static timing analyzer (TRCE in the Xilinx
Development System) and back-annotated to the simulation
netlist. These path delays, provided as a guideline, have
been extracted from the static timing analyzer report. All
timing parameters assume worst-case operating conditions
(supply voltage and junction temperature)XQR4062XL-3CB228I CLB Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all XQR4000XL devices and expressed in nanoseconds unless otherwise noted.
XQR4062XL-3CB228I Tags integrated circuit
1. XQR4062XL development board
2. XQR4062XL-3CB228I Datasheet PDF
3. Xilinx XQR4062XL
4. XQR4062XL reference design
5. Xilinx QPRO XQR4000XL Radiation Hardened FPGAs development board
6. QPRO XQR4000XL Radiation Hardened FPGAs evaluation kit
7. QPRO XQR4000XL Radiation Hardened FPGAs starter kit
8. XQR4062XL evaluation board
9. XQR4062XL reference design
Xilinx XQR4062XL-3CB228I TechnicalAttributes
