XQV300E-3BG352N ApplicationField
-Cloud Computing
-5G Technology
-Artificial Intelligence
-Industrial Control
-Internet of Things
-Consumer Electronics
-Medical Equipment
-Wireless Technology
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XQV300E-3BG352N FAQ Chips
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ICs XQV300E-3BG352N Features
Die-temperature sensing device
100% factory tested
Dedicated multiplier support
Supported by FPGA Foundation and Alliance Development Systems
Guaranteed over the full military temperature range (55C to +125C)
SRAM-based in-system configuration
LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register
IEEE 1149.1 boundary-scan logic
Four programming modes
Cascade chain for wide-input functions
Flexible architecture that balances speed and density
Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)
Hot-swappable for Compact PCI
Wide selection of PC and workstation platforms
Built-in clock-management circuitry
Complete support for Unified Libraries, Relationally Placed Macros, and Design Manager
Internal 3-state bussing
Four dedicated delay-locked loops (DLLs) for advanced clock control
Connects directly to ZBTRAM devices
Fast interfaces to external high-performance RAMs
Dedicated carry logic for high-speed arithmetic
16 high-performance interface standards
Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset
0.22 m 5-layer metal process
Fast, high-density Field-Programmable Gate Arrays
Unlimited reprogrammability
System performance up to 200 MHz
Configurable synchronous dual-ported 4K-bit RAMs
Multi-standard SelectI/O interfaces
Ceramic and Plastic Packages
Densities from 100K to 1M system gates
Contact Defense Supply Center Columbus (DSCC) for more information at http://www.dscc.dla.mil
Hierarchical memory system
Four primary low-skew global clock distribution nets, plus 24 secondary global nets
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Xilinx XQV300E-3BG352N Overview
The QPro Virtex XQV300E-3BG352N FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 5-layer-metal 0.22 m CMOS process. These advances make XQV300E-3BG352N FPGAs powerful and flexible alternatives to mask-programmed gate arrays. Building on experience gained from previous generations of FPGAs, the Virtex XQV300E-3BG352N represents a revolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the QPro Virtex family XQV300E-3BG352N delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.Refer to the Virtex 2.5V Field Programmable Gate Arrays commercial data sheet for more information on device architecture and timing specifications.
XQV300E-3BG352N Tags integrated circuit
1. QPro Virtex 2.5V QML High-Reliability FPGAs starter kit
2. Xilinx XQV300
3. XQV300 development board
4. Xilinx QPro Virtex 2.5V QML High-Reliability FPGAs development board
5. XQV300E-3BG352N Datasheet PDF
6. XQV300 reference design
7. QPro Virtex 2.5V QML High-Reliability FPGAs evaluation kit
8. QPro Virtex 2.5V QML High-Reliability FPGAs XQV300
9. Xilinx QPro Virtex 2.5V QML High-Reliability FPGAs development board
Xilinx XQV300E-3BG352N TechnicalAttributes
