XQV600E-3BG560N -Internet of Things -Consumer Electronics

XQV600E-3BG560N ApplicationField

-Artificial Intelligence
-Cloud Computing
-5G Technology
-Wireless Technology
-Medical Equipment
-Consumer Electronics
-Industrial Control
-Internet of Things

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XQV600E-3BG560N FAQ Chips 

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Q: Where can I purchase Xilinx XQV600E Development Boards, Evaluation Boards, or QPro Virtex-E 1.8V QML High-Reliability FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: Does the price of XQV600E-3BG560N devices fluctuate frequently?
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Q: How to obtain XQV600E-3BG560N technical support documents?
A: Enter the “XQV600E-3BG560N” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

ICs XQV600E-3BG560N Features

– 1.27 mm BGA
– Web-based HDL generation methodology
• Guaranteed over the full military temperature range (–55°C to +125°C)
– Differential I/O signals can be input, output, or I/O
• Highly Flexible SelectIO+ Technology
– Up to 804 singled-ended I/Os or 344 differential I/O pairs for an aggregate bandwidth of > 100 Gb/s
• Differential Signalling Support
– Compatible with standard differential devices
– PCI compliant 3.3V, 32-bit, 33 MHz
• Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)
– Internal 3-state bussing
– Designed for low-power operation
– Up to 640 Kb of synchronous internal block RAM
– 600 Kb of internal configurable distributed RAM
– IEEE 1149.1 boundary-scan logic
• Proprietary High-Performance SelectLink Technology
– Unlimited reprogrammability
– Die-temperature sensor diode
• 0.18 µm 6-Layer Metal Process
• Fast, High-Density 1.8V FPGA Family
• Sophisticated SelectRAM+ Memory Hierarchy
– LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL
– Designed for high-performance Interfaces to External Memories
– Internet Team Design (ITD) tool ideal for million-plus gate density designs
– 130 MHz internal performance (four LUT levels)
• SRAM-Based In-System Configuration
• Supported by Xilinx Foundation and Alliance Series Development Systems
– Further compile time reduction of 50%
– Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset
– Cascade chain for wide-input function
• Ceramic and Plastic Packages
– Memory bandwidth up to 1.66 Tb/s (equivalent bandwidth of over 100 RAMBUS channels)
– Dual port block RAM capability
– Supports 20 high-performance interface standards
– Densities from 600K to 2M system gates
– Double Data Rate (DDR) to Virtex-E link
– Dedicated multiplier support
– 1.0 mm BGA
• Advanced Packaging Options
– Wide selection of PC and workstation platforms
– LVPECL and LVDS clock inputs for 300+ MHz clocks

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Xilinx XQV600E-3BG560N Overview

The Virtex-E FPGA family XQV600E-3BG560N delivers high-performance,
high-capacity programmable logic solutions. Dramatic
increases in silicon efficiency result from optimizing the new
architecture for place-and-route efficiency and exploiting an
aggressive 6-layer metal 0.18 µm CMOS process. These
advances make Virtex-E XQV600E-3BG560N FPGAs powerful and flexible alter natives to mask-programmed gate arrays.XQV600E-3BG560N devices feature a flexible, regular architecture that
comprises an array of configurable logic blocks (CLBs) surrounded by programmable input/output blocks (IOBs), all
interconnected by a rich hierarchy of fast, versatile routing
resources. The abundance of routing resources permits the
Virtex-E family to accommodate even the largest and most
complex designs.
Virtex-E XQV600E-3BG560N FPGAs are SRAM-based, and are customized by
loading configuration data into internal memory cells. Configuration data can be read from an external SPROM (master serial mode), or can be written into the FPGA
(SelectMAP, slave serial, and JTAG modes).
The standard Xilinx Foundation Series and Alliance Series
Development systems deliver complete design support for
Virtex-E, covering every aspect from behavioral and schematic entry, through simulation, automatic design translation and implementation, to the creation and downloading of
a configuration bit stream.Higher Performance
Virtex-E XQV600E-3BG560N devices provide better performance than previous
generations of FPGAs. Designs can achieve synchronous
system clock rates up to 240 MHz including I/O or 622 Mb/s
using Source Synchronous data transmission architechtures. Virtex-E I/Os comply fully with 3.3V PCI specifications, and interfaces can be implemented that operate at
33 MHz or 66 MHz.
While performance is design-dependent, many designs
operate internally at speeds in excess of 133 MHz and can
achieve over 311 MHz.

XQV600E-3BG560N Tags integrated circuit

1. QPro Virtex-E 1.8V QML High-Reliability FPGAs starter kit
2. QPro Virtex-E 1.8V QML High-Reliability FPGAs evaluation kit
3. Xilinx QPro Virtex-E 1.8V QML High-Reliability FPGAs development board
4. XQV600E-3BG560N Datasheet PDF
5. XQV600E evaluation board
6. QPro Virtex-E 1.8V QML High-Reliability FPGAs XQV600E
7. XQV600E reference design
8. Xilinx XQV600E
9. XQV600E-3BG560N Datasheet PDF

Xilinx XQV600E-3BG560N TechnicalAttributes