XC7A200T-2FBG676C ApplicationField
-Internet of Things
-Consumer Electronics
-5G Technology
-Medical Equipment
-Cloud Computing
-Wireless Technology
-Industrial Control
-Artificial Intelligence
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ICs XC7A200T-2FBG676C Features
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
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Xilinx XC7A200T-2FBG676C Overview
Description
Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor,
cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding
high-performance applications. The 7 series FPGAs include:
• Spartan®-7 Family: Optimized for low cost, lowest power, and high
I/O performance. Available in low-cost, very small form-factor
packaging for smallest PCB footprint.
• Artix®-7 Family: Optimized for low power applications requiring serial
transceivers and high DSP and logic throughput. Provides the lowest
total bill of materials cost for high-throughput, cost-sensitive
applications.
• Kintex®-7 Family: Optimized for best price-performance with a 2X
improvement compared to previous generation, enabling a new class
of FPGAs.
• Virtex®-7 Family: Optimized for highest system performance and
capacity with a 2X improvement in system performance. Highest
capability devices enabled by stacked silicon interconnect (SSI)
technology.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an
unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less
power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Feature
• Advanced high-performance FPGA logic based on real 6-input lookup
table (LUT) technology configurable as distributed memory.
• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data
buffering.
• High-performance SelectIO™ technology with support for DDR3
interfaces up to 1,866 Mb/s.
• High-speed serial connectivity with built-in multi-gigabit transceivers
from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a
special low-power mode, optimized for chip-to-chip interfaces.
• A user configurable analog interface (XADC), incorporating dual
12-bit 1MSPS analog-to-digital converters with on-chip thermal and
supply sensors.
• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder
for high-performance filtering, including optimized symmetric
coefficient filtering.
• Powerful clock management tiles (CMT), combining phase-locked
loop (PLL) and mixed-mode clock manager (MMCM) blocks for high
precision and low jitter.
• Quickly deploy embedded processing with MicroBlaze™ processor.
• Integrated block for PCI Express® (PCIe), for up to x8 Gen3
Endpoint and Root Port designs.
• Wide variety of configuration options, including support for
commodity memories, 256-bit AES encryption with HMAC/SHA-256
authentication, and built-in SEU detection and correction.
• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip
packaging offering easy migration between family members in
the same package. All packages available in Pb-free and selected
packages in Pb option.
• Designed for high performance and lowest power with 28 nm,
HKMG, HPL process, 1.0V core voltage process technology and
0.9V core voltage option for even lower power.
The Xilinx FPGAs (Field Programmable Gate Array) series XC7A200T-2FBG676C is FPGA Artix-7 Family 215360 Cells 28nm Technology 1V, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC7A200T-2FBG676C Tags integrated circuit
1. Artix-7 FPGA evaluation kit
2. XC7A200T-2FBG676C Datasheet PDF
3. XC7A200T reference design
4. Xilinx XC7A200T
5. XC7A200T development board
6. XC7A200T evaluation board
7. Artix-7 FPGA starter kit
8. Artix-7 FPGA XC7A200T
9. Xilinx XC7A200T
Xilinx XC7A200T-2FBG676C TechnicalAttributes
-Logic Cells 215,360
-DSP Slices 740
-Memory 13,140
-GTP 6.6Gb/s Transceivers 16
-I/O Pins 500