rogers ro3003

What Does Rogers 3003 High Frequency Material Offer?

PCBs have contributed a great deal to the development of electronic devices in today’s world. Rogers is a well-known PCB company that delivers high-quality laminates. Rogers 3003 is one of the Rogers 3000 series. This PCB material is used in high-frequency applications.

RO3003 is a commonly used circuit board in the electronic industry. This circuit board has got great properties and benefits. In this article, we will shed more light on ro3003.

What is Rogers 3003?

Rogers 3003 is a high frequency circuit material made of ceramic-filled PTFE composites. This laminate is specifically designed for RF and microwave applications. This laminate is a family of Rogers 3000 series. Ro3003 features exceptional mechanical and electrical stability. Irrespective of the dielectric constant of Rogers ro3003, it features consistent mechanical properties.

This PCB is ideal in different applications due to its properties. Therefore, rogers 3003 helps to design multi-layer PCBs that utilize different dielectric constant materials. Also, Rogers ensures the use of high-quality materials in the fabrication of RO3003. Therefore, this board can withstand a high-temperature environment.

Ro3003 is available in most high-frequency boards. This laminate has proved to offer great features; hence, it is useful in most applications. We will discuss these features below.

 

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Properties of RO3003

Ro3003 PCB

RO3003 features great dielectric constant stability at different frequencies and temperatures.  The properties of this PCB include;

Dielectric constant of 3.00+/-0.4

The dielectric constant of a PCB measures the amount of energy a capacitor can store in an electric field. Therefore, Rogers 3003 maintains a great dielectric constant regardless of its application. This ceramic-filled PTFE laminate features a low dielectric constant. This means that it won’t break down easily when exposed to high electric fields. This is a great property of RO3003.

Dielectric loss factor of 0.0013

This property measures the energy derived in the medium as electromagnetic wave goes through the medium. RO3003 has a low dielectric loss factor. Therefore, it is commonly used in RF and microwave communications. A low dielectric loss factor helps signal transfer.

Dissipation factor of 0.0010 at 10GHz

Rogers 3003 features a low dissipation factor. The dissipation factor is the capability of a laminate to act as an insulating material. Also, this factor plays a significant role in the functionality of circuit boards.

In addition, it is a parameter that determines how a laminate will function in varying environments and applications. A lower dissipation factor depicts a more efficient insulator. Therefore, Rogers 3003 is a good insulating material.

Low CTE values

The CTE values of Rogers 3003 at x, y, and Z-axis are 17, 16, and 25 ppm/°C respectively. The coefficient of thermal expansion (CTE) refers to how a material changes in response to temperature change. In reality, it measures the change in the size of material for each degree change in temperature.

RO3003 features low CTE values. A material with low CTE values means that it has a lower propensity to change. Therefore, RO3003 is ideal for use in applications exposed to high temperatures.

Water absorption <0.1

The water absorption of Rogers 3003 is less than 0.1. This means that this board can withstand a humid environment. The ability of a PCB to absorb moisture helps it to withstand humid conditions. In some applications, PCBs are exposed to varying environments. Therefore, the need for water absorption is paramount.

Applications of Rogers RO3003

Rogers RO3003 is useful in several applications. This board offers great electrical and mechanical properties. Therefore, it is an ideal choice for engineers. Below are some of the applications Rogers RO3003 is used;

Direct broadcast satellite

Rogers RO3003 is ideal for use in direct broadcast satellites. This application requires high-frequency laminates that guarantee high signal transmission. Rogers RO3003 meets such requirements. The direct broadcast satellite is a satellite TV system. In this application, signal transmission is achieved in digital format at microwave frequencies. Therefore, Rogers RO303 is a perfect choice for this application.

Automotive radar systems

The automotive radar systems feature RO3003 PCB. These systems are sensor systems in ADAS (autonomous driving assistance systems). They are also the major sensor in adaptive cruise control. Most radar systems operate between the range of 400 MHz and 36GHz. The automotive radar systems require high frequency boards for their design.

Power amplifiers and antennas

Antennas need input signals at great amounts of kilowatts for wireless transmissions. Power amplifiers convert low-power RF signals into a much higher power signal. Rogers 3003 are available in power amplifiers and antennas. This is because it helps to transmit signals at a high speed.

GPS antennas

Rogers RO3003 is ideal for use in GPS antennas. This device receives and amplifies radio signals. GPS antennas amplify the signals transmitted by GNSS satellites. The signal is then transformed into an electronic signal.  Rogers RO3003 is majorly designed for RF and microwave applications. Hence, it is the perfect choice for designing GPS antennas.

Patch antennas for wireless communications

The patch antennas are a good example of an application that uses Rogers 3003. Therefore, they are ideal for wireless communications. RO3003 is available in patch antennas due to their electrical and mechanical properties.

Advantages of RO3003

  • It is reasonably priced. RO3003 is a budget-friendly option
  • It features a wide range of dielectric constant
  • Ideal for multi-layer designs that feature several dielectric constant
  • The low in-plane expansions coefficient of this laminate enables great dimensional stability.
  • Ro3003 features board construction with a multi-layer capability and reliable stripline.
  • Ideal for microstrip patch antenna and band pass filters.
  • It features low DK values which makes it ideal in high-frequency applications.
  • Low Z-axis CTE enables reliable PTH.

 

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Types of Layers on Rogers 3003

There are different types of layers on Rogers 3003.

Mechanical layer

The mechanical layer is available in different types of shapes. It can be circular or rectangular. A typical circuit board features several mechanical layers. However, a PCB engineer requires at least one mechanical layer for the board assembly. This layer helps to outline the board size.

Keep out layer

PCB designers use this layer to specify the design’s working area. Some areas need to be avoided while working on the PCB. The keep out layer identifies these areas on the laminate.

Routing layer

Rogers 3003 comprises a routing layer. The electronic components interconnect through this layer. PCB designers ensure this layer is perfect. The routing layer is available on the outer and inner layers of the board.

Ground and power planes

These layers are crucial. A board features these layers on the top, internal, and bottom parts. Designers connect the power planes to the voltages while the ground planes are connected to the GND.

Silkscreen layers

These layers provide important information on the electronic component at the bottom and top layers. The internal layers don’t feature silkscreens because they will become visible. The silkscreen layer features texts that help during PCB debugging. The texts help you find parts easily.

Solder mask layers

The solder mask layer is a protective layer that covers the top and bottom of the board. This layer prevents trace short when the PCB has debris. Some circuit boards don’t feature a solder mask layer. Solder mask can be on the bottom or top part of the board.

Solder paste layers

PCB designers use solder paste when soldering components on circuit boards. The solder paste layer is ideal when utilizing surface mount components.

What Materials does Rogers 3003 Comprise?

The manufacturing of Rogers 3003 requires some materials. These materials make up Rogers 3003. Manufacturers ensure the best-quality materials are used for the fabrication of Rogers 3003. Below are some of these materials Roger 3003 comprises;

Prepreg

The prepreg is an important material in the fabrication of Rogers RO3003. It is a dielectric material that has been included between a copper foil and core. Prepreg is a fiberglass saturated with resin. Therefore, prepreg is fiberglass reinforced by an adhesive layer. The prepreg keeps the core and copper foil together.

Copper laminates (core)

This material is a thick layer of fiberglass. The core is the base material of Rogers 3003. It is a material laminated with copper on either or both sides. Cores are very crucial in the fabrication of multilayer boards. The core is usually thicker than the prepreg. This is because the thickness influences the resistance and conductivity of the circuit.

Copper foil

This is a negative electrolytic material deposited on a PCB’s base layer. Copper foil is a high conductor of heat and electricity. This material serves as a conductor for Rogers 3003. Manufacturers apply the copper foil on both inner and outer layers.

How to Prevent RO3003 from Overheating

RO3003 is a high-frequency board that can tolerate a particular amount of heat. Temperature affects the functionality of a PCB. When a PCB surpasses its heat limit, the performance will reduce. Therefore, it is important for PCB engineers to focus on how to manage heat.

The electronic components on a circuit board can generate heat. This heat might result in distortion. PCB manufacturers fabricate boards featuring high dielectric constant to solve this problem. PCB can expand when exposed to high temperatures. So, how do you prevent overheating in RO3003?

Use thermal interface materials

Thermal interface materials help to fill up spaces between the PCB’s surfaces. Doing this will help to improve heat transfer between surfaces. Thermal interface materials are better than air in terms of heat conductivity.

Use heavier copper

This is another way to prevent overheating in RO3003. Using heavier copper implies putting traces deeper in the circuit board. So, this will help heat dispersion into the circuit and inside thermal vias. To achieve a high temperature, thicker PCBs require greater thermal energy. This helps to regulate the temperature on the top of the PCB.

Use an active cooling system

You can make use of an active cooling system in your PCBs. This is like a micro fan that will help you cool off the device. You can use this cooling system irrespective of the application’s voltage or size. Insulating ducts can help to alter the fans.

Use heat pipe

There is a limit to which RO3003 can withstand heat. Therefore, a heat pipe is a good way to prevent overheating. Heat pipe is a passive heat transfer approach. It is ideal for compact devices. Heat pipes offer enhanced thermal conductivity. These pipes can hold nitrogen, sodium, water, or acetone.

RO3003 Datasheet

This datasheet provides information about the specific properties of RO3003. The RO3003 datasheet provides the following information;

  • Dielectric constant of 3.00 +- 0.04 at 10 GHz
  • Dissipation factor of 0.0013 at the z-axis
  • Tensile modulus of 900 at x and y axis
  • Water absorption is <0.1
  • Specific heat is 0.9 J/g/K
  • Thermal conductivity of 0.50 W/m/K
  • Coefficient of thermal expansion of 17, 16, and 25 at x, y, and z axis
  • Flammability is v-0
  • Copper peel strength of 12.7 Ib/in
  • Thermal coefficient of 13 ppm/°C at z-axis
  • Dimensional stability at 0.01 at x and Y axis

The RO3003 datasheet sheds more light about its properties. It gives the exact values of each of these parameters.

Frequently Asked Questions

What type of copper foil can I use in Rogers 3003?

There are two different types of copper foil. The rolled copper and electro-deposited copper are the two types of copper foil. The rolled copper is ideal for fabricating rigid-flex and flexible RO3003. Electro-deposited copper is suitable for the fabrication of rigid boards. Therefore, the type of copper foil you use depends on the type of board you are designing.

What are the quality standards of Rogers RO3003?

Rogers RO3003 should adhere to specific standards. These standards help to ensure the circuit board performs well. The standards include UL, RoHS, ISO 9001:2008, and IATF16949.

Conclusion

Rogers 3003 is a high-frequency circuit board. This PCB is ideal for use in several applications. Therefore, it is commonly used among manufacturers. Rogers RO3003 offers mechanical and electrical stability. As a result, it is ideal for use in RF and microwave applications. RO3003 is very easy to fabricate. It is also a budget-friendly option in most applications.

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